Patents by Inventor Joseph G. Ameen
Joseph G. Ameen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7807038Abstract: The present invention provides a method of electrochemical polishing of a workpiece using a polishing pad having a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm; wherein the cellular polymeric layer comprises a plurality of pores that extend through the thickness of the cellular polymeric layer from a polishing surface of the cellular polymeric layer to the conductive substrate; and wherein the plurality of pores exhibit a diameter that is smaller at the polishing surface than at the conductive substrate.Type: GrantFiled: September 14, 2009Date of Patent: October 5, 2010Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.Inventors: Joseph G. Ameen, David B. James
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Publication number: 20100000877Abstract: The present invention provides a method of electrochemical polishing of a workpiece using a polishing pad having a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm; wherein the cellular polymeric layer comprises a plurality of pores that extend through the thickness of the cellular polymeric layer from a polishing surface of the cellular polymeric layer to the conductive substrate; and wherein the plurality of pores exhibit a diameter that is smaller at the polishing surface than at the conductive substrate.Type: ApplicationFiled: September 14, 2009Publication date: January 7, 2010Inventors: Joseph G. Ameen, David B. James
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Patent number: 7618529Abstract: The present invention provides polishing pad for electrochemical mechanical polishing. The pad comprises a cellular polymeric layer overlying a conductive substrate, the cellular polymeric layer having a thickness less than 1.5 mm.Type: GrantFiled: May 25, 2004Date of Patent: November 17, 2009Assignee: Rohm and Haas Electronic Materials CMP Holdings, IncInventors: Joseph G. Ameen, David B. James
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Publication number: 20040232379Abstract: A slurry composition for planarizing nickel or nickel-alloy coating on substrates, such as a nickel coating on a memory hard disk, includes at least two oxidizers, an abrasive, water, and no metal catalyst. The composition is effective for polishing nickel (Ni) and nickel alloys coatings formed in the manufacture of memory disks.Type: ApplicationFiled: August 29, 2003Publication date: November 25, 2004Inventors: Joseph G. Ameen, Zhendong Liu, John Quanci
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Patent number: 5910354Abstract: A metallurgical interconnect composite is provided defined by a compliant, metallurgical, open cell, porous substrate which has a plurality of Z-axis conductive pathways extending from one side of the substrate to the other side. Each conductive pathway terminates in a solder covered surface area.Type: GrantFiled: March 4, 1997Date of Patent: June 8, 1999Assignee: W.L. Gore & Associates, Inc.Inventors: Carmine G. Meola, Daniel D. Johnson, Donald R. Banks, Joseph G. Ameen
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Patent number: 5591034Abstract: A thermally conductive interface is provided suitable for thermal conduction, especially between electronic components. The preferred thermally conductive interface comprises an open structure fluoropolymer material, such as expanded polytetrafluoroethylene, with uncoated thermally conductive particles attached to solid portions thereof. The interface has numerous benefits over previously available material, such as improved thermal conductivity, high conformability, better compressibility, inherent porosity so as to provide air relief, improved stress relief, and high material compliance and resistance to fatigue during thermal cycling.Type: GrantFiled: July 25, 1995Date of Patent: January 7, 1997Assignee: W. L. Gore & Associates, Inc.Inventors: Joseph G. Ameen, Joseph E. Korleski, William P. Mortimer, Jr., Victor P. Yokimcus
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Patent number: 5545473Abstract: A thermally conductive interface is provided suitable for thermal conduction, especially between electronic components. The preferred thermally conductive interface comprises an open structure fluoropolymer material, such as expanded polytetrafluoroethylene, with uncoated thermally conductive particles attached to solid portions thereof. The interface has numerous benefits over previously available material, such as improved thermal conductivity, high conformability, better compressibility, inherent porosity so as to provide air relief, improved stress relief, and high material compliance and resistance to fatigue during thermal cycling.Type: GrantFiled: February 14, 1994Date of Patent: August 13, 1996Assignee: W. L. Gore & Associates, Inc.Inventors: Joseph G. Ameen, William P. Mortimer, Jr., Victor P. Yokimcus
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Patent number: 5321884Abstract: An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e.g., printed circuit board), while also including an opposite end portion which projects from an opposite, upper surface of the first substrate. These upwardly projecting end portions are designed for accommodating, in stacked orientation, a plurality of thin film, flexible circuitized substrates thereon, each of these substrates being electrically coupled to a respective pin, if desired, using a solder composition.Type: GrantFiled: May 20, 1993Date of Patent: June 21, 1994Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Joseph Funari, David W. Sissenstein, Jr.
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Patent number: 5241454Abstract: An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e.g., printed circuit board), while also including an opposite end portion which projects from an opposite, upper surface of the first substrate. These upwardly projecting end portions are designed for accommodating, in stacked orientation, a plurality of thin film, flexible circuitized substrates thereon, each of these substrates being electrically coupled to a respective pin, if desired, using a solder composition.Type: GrantFiled: January 22, 1992Date of Patent: August 31, 1993Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Joseph Funari, David W. Sissenstein, Jr.
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Patent number: 5211328Abstract: A method of precisely depositing accurately defined quantities of solder onto high density circuit patterns on a substrate without use of a solder mask or the like wherein solder paste is originally deposited within a precisely defined transfer member (e.g., graphite block having holes drilled therein), the transfer member then being aligned relative to the respective circuitry such that when both block and substrate are heated, solder flow and deposition will occur without the use of a solder mask or the like. Following deposition, a second circuit member (e.g., flexible circuit) may be electrically coupled to the substrate's conductors, the deposited solder providing the coupling medium. Hydrogen gas may be used during the heating of the paste and also during the soldering of the flexible circuit to the substrate.Type: GrantFiled: May 22, 1992Date of Patent: May 18, 1993Assignee: International Business MachinesInventors: Joseph G. Ameen, Joseph Funari, Ronald J. Moore
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Patent number: 5190595Abstract: An ozone safe method for stripping a silicone oil base grease from a part. The method includes the steps of providing a stripping composition of an alkylbenzene, a solution comprising a major portion of a propylene oxide derived glycol ether, and glacial acetic acid. The part to be stripped is immersed in the composition while ultrasonically agitating the composition.Type: GrantFiled: September 3, 1991Date of Patent: March 2, 1993Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Joseph Funari, Joseph D. Poole, David W. Sissenstein, Jr.
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Patent number: 5115964Abstract: A method of forming electrical connections between a flexible film carrier and an electronic device (e.g., semiconductor chip). The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located on an upper surface thereof. The film carrier is engaged such that bridging portions of conductive leads thereof physically contact these solder mounds. Hot gas is passed through a screen member to heat the bridging portions of the leads to cause these leads to in turn heat the solder mounds to cause the mounds to become molten, whereafter these leads and mounds are cooled to form the desired solder bonds. The resulting structure may form part of an electronic package, this package also described herein.Type: GrantFiled: July 1, 1991Date of Patent: May 26, 1992Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Joseph Funari, John A. Goldfuss, Jr.
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Patent number: 5057969Abstract: A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier electrically coupled thereto. The film carrier includes a dielectric layer (e.g., polyimide) with first and second circuit layers located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures provided within the dielectric. A plurality of solder elements are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads.Type: GrantFiled: September 7, 1990Date of Patent: October 15, 1991Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Joseph Funari, John A. Goldfuss, Jr.
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Patent number: 5028984Abstract: A curable composition containing an epoxide component and zinc oxide and use thereof.Type: GrantFiled: November 4, 1988Date of Patent: July 2, 1991Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Joseph Funari, Bahgat G. Sammakia, David W. Sissenstein, Jr., Samuel L. Smey
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Patent number: 4803100Abstract: A suspension of a coating material having hydrogen bonds and pre-determined physical and chemical characteristics in a predominantly solid state in a polar solvent that is capable of breaking the hydrogen bonds and providing the material in a liquid form and use of the suspension to provide substantially uniform conformal layer of material onto a workpiece by applying the suspension to a workpiece and then evaporating the polar organic solvent so that the coating material is provided in its predominantly solid state having substantially the predetermined physicall and chemical characteristics.Type: GrantFiled: October 21, 1987Date of Patent: February 7, 1989Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Timothy F. Carden, Lawrence R. Cutting, Stephen R. Engle, Ronald J. Moore
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Patent number: 4514232Abstract: The use of an ultrasonically agitated solution which includes UNRESOLVE PLUS and methylene chloride and acetic acid to strip a silicone oil base grease from module caps. The caps are placed in a container of the solution and agitated. They are then removed, water rinsed, and blown dry.Type: GrantFiled: December 15, 1982Date of Patent: April 30, 1985Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Richard H. Hogrogian, Samuel L. Smey
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Patent number: 4370197Abstract: An aqueous acidic composition suitable for etching which contains an acid and a thiourea compound, and use thereof.Type: GrantFiled: June 24, 1981Date of Patent: January 25, 1983Assignee: International Business Machines CorporationInventors: Oscar R. Abolafia, Joseph G. Ameen, Glenn V. Elmore
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Patent number: 4358627Abstract: A process for reducing the chloride concentration in a system which contains an ethylenically unsaturated chlorinated hydrocarbon, water and HCl which includes providing certain nitrogen-containing compounds in the system and contacting the system with a molecular sieve. The process surprisingly is capable of regenerating the nitrogen-containing compounds employed.Type: GrantFiled: April 13, 1981Date of Patent: November 9, 1982Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Charles A. Joseph, Dennis L. Rivenburgh, David W. Sissenstein
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Patent number: 4334949Abstract: A method for reducing the concentration of carbonate in an aqueous solution which includes contacting the aqueous solution with a strongly basic ion-exchange resin.Type: GrantFiled: November 25, 1980Date of Patent: June 15, 1982Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Nelson P. Franchak, John Rasile, Dennis L. Rivenburgh
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Patent number: 4120843Abstract: A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.Type: GrantFiled: April 10, 1978Date of Patent: October 17, 1978Assignee: International Business Machines CorporationInventors: Joseph G. Ameen, Glenn V. Elmore, Anthony E. Peter