Abstract: A tool for insertion and extraction of a packaged IC to and from a socket includes a pair of flexible, parallel arms joined at two ends by a "U" shaped portion. The free ends of the two when moved towards each other are adapted to grip the IC at opposite ends and allow a rocking motion to be applied to loosen the pins of the IC within the socket and then for a lifting force to be applied to remove the IC the socket, all with minimum distortion of the pins. A plunger having a base which is positioned and is free to move between the two parallel walls within the "U" is used to insert an IC into its socket. The IC is positioned between the two walls of the "U" with the pins of the IC pointing outwards and the surface opposite the pins in contact with the base of the plunger. The IC is retained within the "U" by a predetermined interference fit between the walls and the IC.