Patents by Inventor Joseph G Schaefer

Joseph G Schaefer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090110081
    Abstract: An encode control strategy is provided for variable bit rate encoding of a sequence of video frames in a single pass. The control strategy includes determining whether a video frame has a complexity level statistically outside a defined range from a complexity level of at least one preceding frame of the sequence of video frames, and if so, determining a new average bit rate target for the video frame. The new average bit rate for the video frame is determined employing at least one of spatial complexity and temporal complexity of the video frame. The new average bit rate target for the video frame is used to set frame level bit rate control parameter(s), and the video frame is encoded using the set frame level bit rate control parameter(s).
    Type: Application
    Filed: January 12, 2009
    Publication date: April 30, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Charles E. BOICE, Krishna C. RATAKONDA, Joseph G. SCHAEFER, Joseph H. UNDERWOOD
  • Patent number: 7512181
    Abstract: An encode control strategy is provided for variable bit rate encoding of a sequence of video frames in a single pass. The control strategy includes determining whether a video frame has a complexity level statistically outside a defined range from a complexity level of at least one preceding frame of the sequence of video frames, and if so, determining a new average bit rate target for the video frame. The new average bit rate for the video frame is determined employing at least one of spatial complexity and temporal complexity of the video frame. The new average bit rate target for the video frame is used to set frame level bit rate control parameter(s), and the video frame is encoded using the set frame level bit rate control parameter(s).
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: March 31, 2009
    Assignee: International Business Machines Corporation
    Inventors: Charles E. Boice, Krishna C. Ratakonda, Joseph G. Schaefer, Joseph H. Underwood
  • Patent number: 7474701
    Abstract: An encode control strategy is provided for variable bit rate encoding of a sequence of video frames in a single pass. The control strategy includes determining whether a video frame has a complexity level statistically outside a defined range from a complexity level of at least one preceding frame of the sequence of video frames, and if so, determining a new average bit rate target for the video frame. The new average bit rate for the video frame is determined employing at least one of spatial complexity and temporal complexity of the video frame. The new average bit rate target for the video frame is used to set frame level bit rate control parameter(s), and the video frame is encoded using the set frame level bit rate control parameter(s).
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: January 6, 2009
    Assignee: International Business Machines Corporation
    Inventors: Charles E. Boice, Krishna C. Ratakonda, Joseph G. Schaefer, Joseph H. Underwood
  • Publication number: 20080225943
    Abstract: An encode control strategy is provided for variable bit rate encoding of a sequence of video frames in a single pass. The control strategy includes determining whether a video frame has a complexity level statistically outside a defined range from a complexity level of at least one preceding frame of the sequence of video frames, and if so, determining a new average bit rate target for the video frame. The new average bit rate for the video frame is determined employing at least one of spatial complexity and temporal complexity of the video frame. The new average bit rate target for the video frame is used to set frame level bit rate control parameter(s), and the video frame is encoded using the set frame level bit rate control parameter(s).
    Type: Application
    Filed: May 27, 2008
    Publication date: September 18, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Charles E. Boice, Krishna C. Ratakonda, Joseph G. Schaefer, Joseph H. Underwood
  • Patent number: 7072393
    Abstract: System and method are provided for optimally encoding a sequence of video frames using image statistics collected from multiple encoders connected in parallel, each encoder employing a different set of encode parameters. The image statistics are used to select an optimum set of encode parameters for use in encoding the sequence of video frames in a subsequent encode subsystem stage. As an alternative, multiple buffers are connected to the outputs of the multiple, parallel connected encoders, with the encoded stream from the encoder employing the optimum set of encode parameters selected for output as the bitstream of encoded video data.
    Type: Grant
    Filed: June 25, 2001
    Date of Patent: July 4, 2006
    Assignee: International Business Machines Corporation
    Inventors: Charles Boice, Joseph G Schaefer, Brian J Cascarino, Charles C Stein
  • Publication number: 20030012275
    Abstract: System and method are provided for optimally encoding a sequence of video frames using image statistics collected from multiple encoders connected in parallel, each encoder employing a different set of encode parameters. The image statistics are used to select an optimum set of encode parameters for use in encoding the sequence of video frames in a subsequent encode subsystem stage. As an alternative, multiple buffers are connected to the outputs of the multiple, parallel connected encoders, with the encoded stream from the encoder employing the optimum set of encode parameters selected for output as the bitstream of encoded video data.
    Type: Application
    Filed: June 25, 2001
    Publication date: January 16, 2003
    Applicant: International Business Machines Corporation
    Inventors: Charles Boice, Joseph G. Schaefer, Brian J. Cascarino, Charles J. Stein
  • Patent number: 5251806
    Abstract: The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
    Type: Grant
    Filed: April 16, 1992
    Date of Patent: October 12, 1993
    Assignee: International Business Machines Corporation
    Inventors: Birendra N. Agarwala, Aziz M. Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee, Karl J. Puttlitz, Sudipta K. Ray, James G. Ryan, Joseph G. Schaefer, Kamalesh K. Srivastava, Paul A. Totta, Erick G. Walton, Adolf E. Wirsing
  • Patent number: 5130779
    Abstract: The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.
    Type: Grant
    Filed: June 19, 1990
    Date of Patent: July 14, 1992
    Assignee: International Business Machines Corporation
    Inventors: Birendra N. Agarwala, Aziz M. Ahsan, Arthur Bross, Mark F. Chadurjian, Nicholas G. Koopman, Li-Chung Lee, Karl J. Puttlitz, Sudipta K. Ray, James G. Ryan, Joseph G. Schaefer, Kamalesh K. Srivastava, Paul A. Totta, Erick G. Walton, Adolf E. Wirsing
  • Patent number: 4840302
    Abstract: An alloy for contacting portions of a conductive interconnect layer exposed by an overlying organic insulating layer having apertures therethrough. The alloy contains chromium and titanium, and is formed such that at least 50 atm % of the total content of the alloy is titanium at the alloy-insulating layer interface.
    Type: Grant
    Filed: April 15, 1988
    Date of Patent: June 20, 1989
    Assignee: International Business Machines Corporation
    Inventors: David A. Gardner, James G. Ryan, Joseph G. Schaefer, Erick G. Walton