Patents by Inventor Joseph Gerard Hoffarth

Joseph Gerard Hoffarth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capacitor formed within printed circuit board
    Patent number: 5972053
    Abstract: A process for manufacturing a multi-layer printed circuit board comprises a first metallic layer, a first Ta or Hf layer on one face of the first metallic layer, a first layer of Ta.sub.2 O.sub.5 or HfO on a face of the Ta or Hf layer opposite the first metallic layer, a second metallic layer on the Ta.sub.2 O.sub.5 or HfO layer opposite the Ta or Hf layer, a first dielectric layer on the first metallic layer opposite the Ta of Hf layer, and a second dielectric layer on the second metallic layer opposite the Ta.sub.2 O.sub.5 or HfO layer. A multi-layer printed circuit board is formed by adding the following layers to form the second capacitor. A third metallic layer on said second dielectric layer, a second Ta or Hf layer on a face of the third metallic layer, a second Ta.sub.2 O.sub.5 or HfO layer on a face of the second Ta or Hf layer opposite the third metallic layer, a fourth metallic layer on the second Ta.sub.2 O.sub.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: October 26, 1999
    Assignee: International Business Machines Corporation
    Inventors: Joseph Gerard Hoffarth, John Matthew Lauffer, Issa Said Mahmoud, deceased
  • Capacitor formed within printed circuit board
    Patent number: 5745334
    Abstract: A multi-layer printed circuit board comprises a first metallic layer, a first Ta or Hf layer on one face of the first metallic layer, a first layer of Ta.sub.2 O.sub.5 or HfO on a face of the Ta or Hf layer opposite the first metallic layer, a second metallic layer on the Ta.sub.2 O.sub.5 or HfO layer opposite the Ta or Hf layer, a first dielectric layer on the first metallic layer opposite the Ta of Hf layer, and a second dielectric layer on the second metallic layer opposite the Ta.sub.2 O.sub.5 or HfO layer. A multi-layer printed circuit board is formed by adding the following layers to form the second capacitor. A third metallic layer on said second dielectric layer, a second Ta or Hf layer on a face of the third metallic layer, a second Ta.sub.2 O.sub.5 or HfO layer on a face of the second Ta or Hf layer opposite the third metallic layer, a fourth metallic layer on the second Ta.sub.2 O.sub.
    Type: Grant
    Filed: March 25, 1996
    Date of Patent: April 28, 1998
    Assignee: International Business Machines Corporation
    Inventors: Joseph Gerard Hoffarth, John Matthew Lauffer, Issa Said Mahmoud, deceased