Patents by Inventor Joseph Hallisey
Joseph Hallisey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230335414Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: March 21, 2023Publication date: October 19, 2023Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Publication number: 20230245910Abstract: A substrate transport apparatus having a drive section and at least one articulated multi-link arm having an upper arm joined at one end to the drive section and a forearm joined to the upper arm. The upper arm being a substantially rigid unarticulated link. Dual end effector links that are separate and distinct from each other are each rotatably and separately joined to a common end of the forearm about a common axis of rotation. Each end effector link has at least one holding station. The holding station of at least one end effector link includes one holding station at opposite ends of the at least one end effector link that is substantially rigid and unarticulated between the opposite ends, and the holding station at one of the opposite ends is substantially coplanar with the holding station of each other end effector link.Type: ApplicationFiled: January 30, 2023Publication date: August 3, 2023Inventors: Alexander Krupyshev, Joseph Hallisey, Kevin Bourbeau, Emilien Audebrand
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Patent number: 11610787Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: December 1, 2020Date of Patent: March 21, 2023Assignee: Brooks Automation US, LLCInventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 11569111Abstract: A substrate transport apparatus having a drive section and at least one articulated multi-link arm having an upper arm joined at one end to the drive section and a forearm joined to the upper arm. The upper arm being a substantially rigid unarticulated link. Dual end effector links that are separate and distinct from each other are each rotatably and separately joined to a common end of the forearm about a common axis of rotation. Each end effector link has at least one holding station. The holding station of at least one end effector link includes one holding station at opposite ends of the at least one end effector link that is substantially rigid and unarticulated between the opposite ends, and the holding station at one of the opposite ends is substantially coplanar with the holding station of each other end effector link.Type: GrantFiled: December 1, 2020Date of Patent: January 31, 2023Assignee: Brooks Automation US, LLCInventors: Alexander Krupyshev, Joseph Hallisey, Kevin Bourbeau, Emilien Audebrand
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Publication number: 20210183675Abstract: A substrate transport apparatus having a drive section and at least one articulated multi-link arm having an upper arm joined at one end to the drive section and a forearm joined to the upper arm. The upper arm being a substantially rigid unarticulated link. Dual end effector links that are separate and distinct from each other are each rotatably and separately joined to a common end of the forearm about a common axis of rotation. Each end effector link has at least one holding station. The holding station of at least one end effector link includes one holding station at opposite ends of the at least one end effector link that is substantially rigid and unarticulated between the opposite ends, and the holding station at one of the opposite ends is substantially coplanar with the holding station of each other end effector link.Type: ApplicationFiled: December 1, 2020Publication date: June 17, 2021Inventors: Alexander Krupyshev, Joseph Hallisey, Kevin Bourbeau, Emilien Audebrand
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Publication number: 20210175096Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: December 1, 2020Publication date: June 10, 2021Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C, BLAHNIK, Ho Yin Owen FONG
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Patent number: 10854478Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: December 20, 2019Date of Patent: December 1, 2020Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20200126820Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: December 20, 2019Publication date: April 23, 2020Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 10541157Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: October 24, 2016Date of Patent: January 21, 2020Assignee: BROOKS AUTOMATION, INC.Inventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20180308728Abstract: A substrate processing apparatus includes a linearly elongated substantially hexahedron shaped substrate transport chamber having linearly elongated sides of the hexahedron and at least one end wall of the hexahedron substantially orthogonal to the linearly elongated sides. A plurality of process modules are linearly arrayed along the at least one of the linearly elongated sides. A substrate transport arm is pivotally mounted within the substrate transport chamber so that a pivot axis of the substrate transport arm is mounted, fixed relative to the substrate transport chamber. The substrate transport arm has a three linkâthree joint SCARA configuration, of which one link is an end effector with at least one substrate holder, that is articulate to transport the substrate, and held by the at least one substrate holder, in and out of the substrate transport chamber through the end and side substrate transport openings.Type: ApplicationFiled: February 6, 2018Publication date: October 25, 2018Inventors: Alexander KRUPYSHEV, Leigh F. SHARROCK, Joseph HALLISEY
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Publication number: 20180226280Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: October 24, 2016Publication date: August 9, 2018Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Publication number: 20180114708Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: October 24, 2016Publication date: April 26, 2018Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 9478446Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: March 3, 2014Date of Patent: October 25, 2016Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20140178157Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: March 3, 2014Publication date: June 26, 2014Applicant: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 8662812Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: September 24, 2012Date of Patent: March 4, 2014Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 8272825Abstract: A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.Type: GrantFiled: May 19, 2008Date of Patent: September 25, 2012Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20090016855Abstract: A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.Type: ApplicationFiled: May 19, 2008Publication date: January 15, 2009Applicant: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Fong