Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.

Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.

Abstract: A method of forming an assembly is provided. The method includes attaching a packaged semiconductor device to a substrate. An isolation structure is formed and located between the packaged semiconductor device and the substrate. An underfill material is dispensed between the packaged semiconductor device and the substrate. The isolation structure prevents the underfill material from contacting a first conductive connection formed between the packaged semiconductor device and the substrate.

Abstract: One embodiment of a packaged semiconductor device includes: a redistributed layer (RDL) structure formed over an active side of a semiconductor die embedded in mold compound, the RDL structure includes a plurality of solder ball pads that in turn includes: a set of first solder ball pads located on a front side of the packaged semiconductor device within a footprint of the semiconductor die, and a set of second solder ball pads located on the front side of the packaged semiconductor device outside of the footprint of the semiconductor die, each first solder ball pad includes a first center portion having a first diameter measured between opposite outer edges of the first center portion, each second solder ball pad includes a second center portion having a second diameter measured between opposite outer edges of the second center portion, and the first diameter is smaller than the second diameter.

Abstract: An IGRT apparatus comprising a medical imaging device (1) integrated with a linear accelerator (3, 4), the linear accelerator (3, 4) configured for emitting a radiation beam which is shaped by a beam shaper (8, 17), wherein the position of the beam shaper (8, 17) is adjustable between a first position and a second position, wherein the first position is a treatment position and the second position is a non-treatment position and wherein the IGRT apparatus comprises a gantry (2) and wherein the first position is within the gantry (2) and the second position is removed from the gantry (2).

Abstract: A device includes a memory, at least two input/output (IO) pins, and slave identifier (ID) selection circuitry. The memory stores a slave ID, which identifies the device to other devices in a serial communication process. The slave ID selection circuitry changes the stored slave ID based on which one of the IO pins is coupled to a supply voltage. By changing the slave ID of the device based on which one of the IO pins is coupled to a supply voltage, a number of devices with otherwise identical slave IDs may change their slave IDs in order to participate in a serial communication process on the same bus. Further, the slave ID of the device may be changed without using an additional IO pin on the device.

Abstract: A radiation therapy apparatus includes a radiation source and a ring shaped gantry. The gantry includes a static ring component and a dynamic ring component upon which the radiation source is mounted, the dynamic ring component is rotatable about its center and is provided in multiple arcuate parts that can be assembled together to form the dynamic ring component.

Abstract: A direct current (DC)-DC converter, which includes a charge pump buck power supply and a buck power supply is disclosed. The charge pump buck power supply includes a charge pump buck converter, a first inductive element, and an energy storage element. The charge pump buck converter and the first inductive element are coupled in series between a DC power supply, such as a battery, and the energy storage element. The buck power supply includes a buck converter, a second inductive element, and the energy storage element. The buck converter and the second inductive element are coupled in series between the DC power supply and the energy storage element. As such, the charge pump buck power supply and the buck power supply share the energy storage element.

Abstract: The invention relates to an enclosure with a substantial rectangular configuration, adapted to contain an apparatus sensitive to acoustic vibrations, the enclosure comprising walls and acoustic damping material located within the wall, wherein the acoustic damping material comprises at least one absorbing body of acoustic energy absorbing material located adjacent to a rib of the enclosure. The acoustic vibrations most disturbing the processes in the apparatus within the enclosure are caused by standing acoustic waves within the enclosure with frequencies in the range between 50 Hz and 1000 Hz. These acoustic waves are efficiently damped by the provision of a block of acoustic absorbing material adjacent to one of the ribs of the enclosure, to such an extent that the need for thick walls of the enclosure is substantially obviated, leading to a less voluminous enclosure.

Abstract: An IGRT apparatus comprising a medical imaging device (1) integrated with a linear accelerator (3, 4), the linear accelerator (3, 4) configured for emitting a radiation beam which is shaped by a beam shaper (8, 17), wherein the position of the beam shaper (8, 17) is adjustable between a first position and a second position, wherein the first position is a treatment position and the second position is a non-treatment position and wherein the IGRT apparatus comprises a gantry (2) and wherein the first position is within the gantry (2) and the second position is removed from the gantry (2).

Abstract: An IGRT apparatus includes a medical imaging device integrated with a linear accelerator, the linear accelerator is configured for emitting a radiation beam, which is shaped by a beam shaper, and a gantry. The position of the beam shaper is adjustable between a first position and a second position; the first position is a treatment position and the second position is a non-treatment position and the first position is within the gantry and the second position is removed from the gantry.

Abstract: Analog-to-digital pulse width modulation circuitry includes thermometer code generator circuitry, clock generator circuitry, delay selection circuitry, and an output stage. The thermometer code generator circuitry is adapted to generate a digital thermometer code based upon a received analog input voltage. The clock generator circuitry is adapted to generate a reference clock and a plurality of delayed clock signals. The delay selection circuitry is connected between the thermometer code generator circuitry and the clock generator circuitry, and is adapted to select one of the delayed clock signals to present to the output stage based upon the generated thermometer code. The selected delayed clock signal is delayed by an amount of time that is proportional to the generated thermometer code. The reference clock signal and the selected delayed clock signal are delivered to the output stage where they are used to generate a pulse width modulated output signal.

Abstract: A system and computer implemented method for producing a user configuration profile of a software configuration including software configuration modifications selected by a user which read by an installer engine in comparison to the software configuration allows installation of an updated software configuration including the software configuration modifications selected by the user.

Abstract: The present disclosure relates to a flexible direct current (DC)-DC converter, which includes a charge pump buck power supply and a buck power supply. The charge pump buck power supply and the buck power supply are voltage compatible with one another at respective output inductance nodes to provide flexibility. In one embodiment of the DC-DC converter, capacitances at the output inductance nodes are at least partially isolated from one another by using at least an isolating inductive element between the output inductance nodes to increase efficiency. In an alternate embodiment of the DC-DC converter, the output inductance nodes are coupled to one another, such that the charge pump buck power supply and the buck power supply share a first inductive element, thereby eliminating the isolating inductive element, which reduces size and cost but may also reduce efficiency.

Abstract: An IGRT apparatus includes a medical imaging device integrated with a linear accelerator, the linear accelerator is configured for emitting a radiation beam, which is shaped by a beam shaper, and a gantry. The position of the beam shaper is adjustable between a first position and a second position; the first position is a treatment position and the second position is a non-treatment position and the first position is within the gantry and the second position is removed from the gantry.

Abstract: A radiation therapy apparatus includes a radiation source and a ring shaped gantry. The gantry includes a static ring component and a dynamic ring component upon which the radiation source is mounted, the dynamic ring component is rotatable about its center and is provided in multiple arcuate parts that can be assembled together to form the dynamic ring component.

Abstract: A device includes a memory, at least two input/output (IO) pins, and slave identifier (ID) selection circuitry. The memory stores a slave ID, which identifies the device to other devices in a serial communication process. The slave ID selection circuitry changes the stored slave ID based on which one of the IO pins is coupled to a supply voltage. By changing the slave ID of the device based on which one of the IO pins is coupled to a supply voltage, a number of devices with otherwise identical slave IDs may change their slave IDs in order to participate in a serial communication process on the same bus. Further, the slave ID of the device may be changed without using an additional IO pin on the device.

Abstract: At least a first shunt switching element and switching control circuitry of a first switching power supply are disclosed. At least the first shunt switching element is coupled between a ground and an output inductance node of the first switching power supply. The first switching power supply provides a buck output signal from the output inductance node. The switching control circuitry selects one of an ON state and an OFF state of the first shunt switching element. When the buck output signal is above a first threshold, the switching control circuitry is inhibited from selecting the ON state. The first switching power supply provides a first switching power supply output signal based on the buck output signal. By using feedback based on the buck output signal, the switching control circuitry may refine the timing of switching between series switching elements and shunt switching elements to increase efficiency.

Abstract: A system and computer implemented method for producing a user configuration profile of a software configuration including software configuration modifications selected by a user which read by an installer engine in comparison to the software configuration allows installation of an updated software configuration including the software configuration modifications selected by the user.

Abstract: The described devices, systems and methods include an electro-static discharge clamp with a latch to prevent false triggering of an electro-static discharge protection circuit in response to fluctuations in a power supply rail.