Abstract: A flame retardant levulinic acid-based compound, a process for forming a levulinic acid-based flame retardant polymer, and an article of manufacture comprising a material that contains a flame retardant levulinic acid-based polymer are disclosed. The flame retardant levulinic acid-based compound has variable moieties, which include phenyl-substituted and/or R functionalized flame retardant groups. The process for forming the flame retardant polymer includes forming a phosphorus-based flame retardant molecule, forming a levulinic acid derivative, chemically reacting the phosphorus-based flame retardant molecule and the levulinic acid derivative to form a flame retardant levulinic acid-based compound, and incorporating the levulinic acid-based flame retardant compound into a polymer to form the flame retardant polymer.

Abstract: Circuit feature casting for manufacture observation is disclosed herein. According to an aspect, a method includes applying a molding material to a feature of a circuit to substantially cover the feature with the molding material. The method also includes curing the molding material. Further, the method includes separating the molding material from the feature to reveal a cast of the feature of the circuit.

Abstract: Embodiments herein describe a capillary containing a eutectic conductive liquid (e.g., EGaIn) and an electrolyte (e.g., NaOH) that is integrated into a printed circuit board (PCB). In one embodiment, the PCB includes a capillary, a negative electrode, a positive electrode, a plurality of insulation layers, and a conductive layer. The capillary extends through the PCB. The capillary includes a side surface forming an annular cylinder. A eutectic conductive liquid and an electrolyte are disposed within an aperture formed by the side surface. An electrode extends through the side surface and contacts at least the eutectic conductive liquid or the electrolyte. The negative electrode is disposed at a first end of the capillary. The positive electrode is disposed at a second end of the capillary. The conductive layer is disposed between two of the plurality of insulation layers. The electrode forms an electrical connection with the conductive layer.

Abstract: In an example, an article of manufacture includes a composite material. The composite material includes hollow glass filaments that are encapsulated within a polymeric matrix material. The hollow glass filaments are at least partially filled with the polymeric matrix material.

Abstract: In an embodiment is provided a method of making a photo-absorbing composition that includes forming a donor-acceptor small molecule (DASM) by bonding an electron donor portion to an electron acceptor portion; and bonding the DASM to a nanographene structure using a Stille coupling reaction, a Suzuki cross-coupling reaction, or a C—H activation cross-coupling reaction. In another embodiment is provided films that include a photo-absorbing composition.

Abstract: A thermal interface material (TIM) includes a modified release layer having an organosilane-coated surface covalently bound to a TIM formulation layer. The modified release layer may be formed by applying an organosilane (e.g., vinyltriethoxysilane) to the surface of a thermally conductive release layer (e.g., aluminum foil). The organosilane reacts with hydroxyl groups on the surface of the thermally conductive release layer. The TIM formulation layer may be formed by applying a TIM formulation (e.g., a graphite TIM formulation) containing an unsaturated monomer (e.g., methyl acrylate) to the organosilane-coated surface of the modified release layer, and then curing the TIM formulation so that the unsaturated monomer of the TIM formulation reacts with the organosilane-coated surface of the modified release layer.

Abstract: Acoustic dampeners, methods of making acoustic dampener, and uses thereof are described. The acoustic dampener includes a polymer foam article; and a metal-organic framework portion. The metal-organic framework portion comprises a metal-organic framework in a polymer matrix. The metal-organic framework portion is adhered to, or otherwise coupled to or included with, the polymer foam article. Such an acoustic dampener can be used in a computer equipment cabinet.

Abstract: A method for fabricating an asymmetric printed circuit board with minimized warpage. The method includes determining a first resin area and a second resin area in a stack of printed circuit board layers. The method further includes performing computer modeling to predict a warpage of the printed circuit board layers during a predicted use of the printed circuit board layers. The method further includes determining a first target coefficient of thermal expansion for the first resin area and a second target coefficient of thermal expansion for the second resin area based on the computer modeling. The method further includes differentially curing resin in the first resin area and the second resin area based on the first target coefficient of thermal expansion and the second target coefficient of thermal expansion. The method further includes forming an asymmetric printed circuit board from the stack of printed circuit board layers.

Abstract: Disclosed aspects relate to a structure which includes shape memory materials having transition triggers to transition the shape memory materials between initial states and transitioned states. A first physical shape of the structure exists when the first shape memory material has the first initial state and the second shape memory material has the second initial state. A second physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second initial state. A third physical shape of the structure exists when the first shape memory material has the first transitioned state and the second shape memory material has the second transitioned state. The physical shapes of the structure are reversible in nature. In embodiments, the shape memory materials are bonded to a flexible substrate or are clad together.

Abstract: A process of forming a hydrophobic, conductive barrier on a metallic surface includes coating the metallic surface with an organic, conductive material. The organic, conductive material includes a conductive group having two or more alkyne groups and a dithiocarbamate group to bind the organic, conductive material to the metallic surface.

Abstract: An impact-modified composition and a method of making an impact-modified composition are provided. In an embodiment, the method includes reacting a phosphazene material with an acrylamide material to form a functionalized phosphazene material; initiating a polymerization reaction on a reaction mixture comprising the functionalized phosphazene material and one or more monomers to form an impact-modified phosphazene material; and adding the an impact-modified phosphazene material to a polymeric material.

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI) and an electroactive polymer (EAP) structure. The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The EAP structure is disposed around at least a portion of the CPI. The EAP structure is configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP structure is in the first position and a second, different electrical resistance when the EAP structure is in the second position.

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.

Abstract: A process of utilizing a water-sensitive fluorophore for moisture content evaluation in a hygroscopic polymer includes forming a blend that includes a hygroscopic polymer resin and a water-sensitive fluorophore. The process includes forming pellets having a particular geometry from the blend, determining fluorescence properties of at least one of the pellets, and determining moisture content of at least one of the pellets. The process also includes generating a calibration curve for the particular pellet geometry by correlating the fluorescence properties with the moisture content. The process further includes providing the calibration curve for non-destructive moisture content evaluation of a material derived from the pellets.

Abstract: A process includes removing air bubbles from extracorporeal blood via chemical entrapment of nitrogen (N2) gas.

Abstract: A process of forming a sustained-release pesticide coating, a process of forming a sustained-release pesticide capsule, and a sustained-release pesticide coating are disclosed. The process of forming the sustained-release pesticide coating includes depositing a first layer that includes a first pesticide onto a surface, and depositing a second layer that includes a photodegradable material onto the first layer. The process of forming the sustained-release pesticide coating also includes depositing a third layer that includes a second pesticide onto the second layer. The process of forming the sustained release pesticide capsule includes selecting a pesticide, selecting a photosensitive compound, and encapsulating the pesticide in a photosensitive capsule that includes a polymer formed from the photosensitive compound. The sustained-release pesticide coating includes a pesticide and a material having a photosensitive component.

Abstract: Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI) and an electroactive polymer (EAP) structure. The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The EAP structure is disposed around at least a portion of the CPI. The EAP structure is configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP structure is in the first position and a second, different electrical resistance when the EAP structure is in the second position.

Abstract: Method, apparatus, and computer program product are provided for determining a maximum temperature to which a perishable good or other temperature sensitive item was exposed. In some embodiments, a capacitance of a circuit provided on a substrate is measured. The circuit includes capacitor(s) each having first and second plates separated from each other by an ionic liquid (IL) in a solid state. The IL melts at a predetermined temperature and flows away from the first and second plates into a void. In some embodiments, the predetermined temperature at which the IL melts is different for each capacitor. For example, each capacitor in the circuit may employ a different N-alkyl bezothiazolium salt. A maximum temperature of exposure is determined based on the measured capacitance. In some embodiments, a decision of whether to discard the perishable good or other temperature sensitive item may be based on the determined maximum temperature.