Abstract: A method is provided to reduce differences between the way in which reticle chucking forces and gravity force act upon the reticle during use and during assembly of the pellicle, and to combine this with a similar reduction concerning pellicle chucking forces and gravity force acting upon the pellicle during bonding to the reticle and during quality control of the pellicle. The shape of the pellicle is measured for control in the same orientation of the pellicle with respect to gravity force as during use of the pellicle, and during bonding the pellicle and the reticle are held in the same way and in the same orientation as during control of the pellicle and use of the reticle in the lithographic apparatus, respectively.

Abstract: A reticle frame for precisely holding a reticle or mask used in photolithography with a minimum of distortion. A plurality of adjusting screws are used to accurately position the reticle within the frame. Transversely compliant axial loading springs opposing the adjusting screws reduce the bending forces acting on the reticle. Precision balls are used to establish a plane for the reticle further reducing bending forces thereon causing less distortion and thereby proving greater resolution when the reticle image is reproduced on a semiconductor wafer.

Abstract: The described invention is a precisely adjustable transporter for moving a reticle past an optical slit as a step in the production of semiconductor wafers. The reticle stage rides along a pair of optically flat planar, intersecting, bearing surfaces supported by air bearings on each bearing surface. Pressurized air and vacuum may be simultaneously employed to effect substantially friction-free motion while preventing displacement from the bearing surfaces. Axial adjustments on each air bearing permit precise adjustment of the reticle stage and reticle.

Abstract: A wafer chuck assembly having an elevator for accepting a wafer and placing it precisely on a platen without changing its spatial orientation.