Abstract: Additive manufacturing apparatuses are disclosed. In one embodiment, an additive manufacturing apparatus may comprise a support chassis including a print bay, a build bay, and a material supply bay. Each bay may comprise an upper compartment and a lower compartment. A working surface may separate each of the print bay, the build bay, and the material supply bay into the upper compartment and the lower compartment, wherein: the build bay may be disposed between the print bay and the material supply bay. The lower compartment of the build bay comprises bulkheads sealing the lower compartment of the build bay from the lower compartment of the print bay and the lower compartment of the material supply bay.

Abstract: Build receptacles for additive manufacturing apparatuses are disclosed. The build receptacle may comprise a housing comprising a sidewall at least partially enclosing a build chamber. A build platform may be positioned within the build chamber. A position of the build platform may be slidably adjustable within the build chamber in a vertical direction from a lower position to one of a plurality of upper positions and from the one of the plurality of upper positions to the lower position. The build receptacle may further comprise a plurality of heating elements disposed around the build chamber.

Abstract: Additive manufacturing apparatuses, components of additive manufacturing apparatuses, and methods of using such manufacturing apparatuses and components are disclosed. An additive manufacturing apparatus may include a recoat head for distributing build material in a build area, a print head for depositing material in the build area, one or more actuators for moving the recoat head and the print head relative to the build area, and a cleaning station for cleaning the print head.

Abstract: A method for storing data including: providing a first substrate having a plurality of micro-holograms therein, the micro-holograms being indicative of the data; providing a second hologram-supporting substrate; illuminating the plurality of micro-holograms in the first substrate through the second substrate, thereby producing a holographic pattern in the second substrate indicative of reflections of the plurality of micro-holograms in the first substrate; providing a third hologram-supporting substrate; and, illuminating the holographic pattern in the second substrate through the third substrate, thereby substantially replicating the plurality of micro-holograms in the first substrate in the third substrate.

Abstract: In an AC to DC power conversion circuit including a boost inductor connected in series between a full-wave rectifier and a DC load, a switch is connected to selectively shunt boost inductor current from the load. Switch conduction is controlled by a pulse width modulator generating switching pulses at a high fixed frequency. The pulse widths are automatically varied as a function of boost inductor current, load voltage, and an ideal sinusoidal waveform derived from the AC input voltage to force the boost inductor current to closely conform to the ideal sinusoidal waveform and thus minimize harmonic distortion, while achieving load voltage regulation and near unity power factor.