Abstract: A status of one or more components of a battery monitor circuit can be evaluated, such as to validate operation of the monitor circuit. In an example, a battery monitor circuit can be evaluated by providing a first test signal to a battery voltage measurement circuit that is coupled to a battery. A first analog-to-digital converter (ADC) circuit can be configured to receive a first voltage signal from the battery voltage measurement circuit in response to the first test signal. A processor circuit can be configured to validate the first ADC circuit by evaluating a correspondence between the first test signal and the received first voltage signal. One or more other ADC circuits in the battery monitor circuit can be validated by cross-checking measurement results with information from the first ADC circuit.

Abstract: A status of one or more components of a battery monitor circuit can be evaluated, such as to validate operation of the monitor circuit. In an example, a battery monitor circuit can be evaluated by providing a first test signal to a battery voltage measurement circuit that is coupled to a battery. A first analog-to-digital converter (ADC) circuit can be configured to receive a first voltage signal from the battery voltage measurement circuit in response to the first test signal. A processor circuit can be configured to validate the first ADC circuit by evaluating a correspondence between the first test signal and the received first voltage signal. One or more other ADC circuits in the battery monitor circuit can be validated by cross-checking measurement results with information from the first ADC circuit.

Abstract: A method comprises forming a first structured pattern having a first line width on a substrate. A polymer brush is deposited on the structured pattern, which is annealed a first time at a first temperature and then annealed a second time at a second temperature higher than the first temperature. A block copolymer is deposited on the structured pattern and polymer brush, and aligned first block and second block structures are formed on the structured pattern and polymer brush. The first block structures and portions of the polymer brush and the structured pattern positioned beneath the first block structures are removed, and the substrate between the second block structures is exposed. The second block structures are then removed to form a second structured pattern in the substrate having a second line width, the second line width being smaller than the first line width.

Abstract: A computer-implemented method for automatically generating genetic risk assessments including (1) receiving a data share, derived from an electronic health records system, that indicates that a patient has scheduled an appointment with a healthcare provider, (2) in response to identifying that the patient has scheduled an appointment with the healthcare provider, sending a digital family history request to the patient in preparation for the scheduled appointment, the digital family history request including a link to a third-party portal and a request to access and complete an electronic family history form using the third-party portal, (3) receiving, through the third-party portal, responses to the family history form that the patient submitted using the third-party portal, (4) generating a genetic risk assessment for the patient based on the responses received through the third-party portal, and (5) based on the genetic risk assessment of (4), generating a three-generation patient pedigree.

Abstract: This invention relates to a method of making an olefin from a dialkyl ether comprising (a) introducing an ether having a formula CxH2x+1CyH2y+1 into a thermal or catalytic cracking unit processing a hydrocarbon feedstock; and (b) decomposing at least a portion of the ether to form an olefin having a formula CxH2x and/or CyH2y and an alcohol having a formula CxH2x+1 and/or CyH2y+1OH, wherein x and y independently range from about 1 to about 30. This invention also relates to a method of reducing coking in a thermal or catalytic cracking unit comprising (a) introducing an ether, having a formula CxH2x+1OCyH2y+1, into the cracking unit processing a hydrocarbon feedstock in an amount effective to reduce coke formation relative to processing the hydrocarbon feedstock in the absence of the ether, wherein x and y independently range from about 1 to about 30.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: A dual pendulum valve assembly including a housing having an interior space and first and second openings through which fluid can enter and exit the interior space; valve seats disposed in the interior space around the edges of the openings; and first and second pendulum valves for opening and closing, respectively, the first and second openings. Each pendulum valve is independently movable and includes a valve body mounted relative to the housing so that the valve body is movable between a completely opened position wherein fluid is allowed to pass through its respective opening and a completely closed position wherein the valve body seals the opening so that fluid can not pass therethrough.

Abstract: An integrated wafer processing system having a wafer queuing station and a plurality of plasma reactors connected to peripheral walls of a central vacuum chamber. Vacuum valves separate the central chamber from the queuing station and the plasma reactors. A wafer transfer arm capable of R-&THgr; motion can transfer wafers between the queuing station and any of the plasma reactors in either a single-step or a multi-step process.

Abstract: The present invention includes plural plasma processing vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. In the preferred embodiment, the several plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus.

Abstract: A gas delivery system comprises a common mounting block that supports the components in a predetermined arrangement and defines passageways between components so that a gas can flow through the passageways and components along a predetermined flow path. The mounting block is formed so that at least a portion of at least one mechanical part of at least one component is provided in the block, the passageways connect the components together and the remaining portion of each component not formed in the block is removably attached to the block. The electrical circuitry that is used to operate the components is separately provided remote from the components so that replacement of a component replaces those mechanical parts of the components not provided in the block, without requiring the replacement of the electrical components.

Abstract: A gas delivery system comprises a gate valve that can be connected between a turbo pump and a process chamber. The gate valve includes a valve body, a valve seat and a housing constructed to support the valve seat, wherein (a) the valve body is secured within the housing so as to move relative to the valve seat between an opened position and a closed position, and (b) the housing is provided with a gas passageway connected to each of the spaces on opposite sides of the valve body when the valve body is in the closed position. A plurality of valves are mounted to the housing of the gate valve and arranged so as to control the flow of gas through the passageway so that in operation the chamber and turbo pump each can be pumped down through the gas passageway with a second pump connected to one of the valves, and gas can be transferred and the flow controlled through the passageway bypassing the valve body when the valve body is in the closed position.

Abstract: A substrate processing system is provided that includes substrate processing vessels, a substrate queuing station, a substrate transfer device, and a processor. The processor, in communication with the processing vessels, the queuing station, and the transfer device, provides selectable single and multi-step processing of the substrates by accessing a process command for a given substrate corresponding to desired processing of the substrate.

Abstract: The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. In the preferred embodiment, the several plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus.

Abstract: The present invention includes plural plasma etching vessels and a wafer queuing station arrayed with a wafer transfer arm in a controlled environment. Wafers are movable within the controlled environment one at a time selectably between the plasma vessels and the wafer queuing station without atmospheric or other possible contamination. The system is selectively operative in either single-step or multiple-step processing modes. In the preferred embodiment, the plasma vessels and the queuing station are arrayed about a closed pentagonal locus with the wafer transfer arm disposed within the closed locus. The wafer transfer arm is movable between the plasma etching vessels and the wafer queuing station. Selectably actuable vacuum locks are provided between the plasma etching vessels and the wafer transfer arm to maintain an intended atmospheric condition and to allow wafer transport therethrough. The plasma vessels each include first and second water-cooled electrodes that are movable relatively to each other.

Abstract: Hollow-anode glow discharge apparatus in the form of two-electrode and three-electrode reactors provide, in various embodiments, improved uniformity, efficiency and low-pressure substrate surface processing. In one improved uniformity embodiment for ion-dominated processes, the apparatus of the invention includes a high-energy-density uniformizing grid having multiple, multi-sized and evenly-spaced holes. In one improved uniformity embodiment for chemically-dominated processes, the apparatus of the invention includes a high-energy-density uniformizing grid having multiple, evenly-spaced holes and a stepped or continuously-variable non-planar profile. In one improved low pressure embodiment for ion-dominated and/or chemically-dominated processes, the apparatus of the invention includes a high-energy-density grid having multiple, evenly-sized and spaced holes of widths large enough to overcome dark space effects.

Abstract: Plural plasma etching vessels and a wafer queuing station are arrayed about a closed pentagonal locus with a wafer transfer arm therewithin all in a controlled vacuum environment. Wafers are movable within the controlled environment between the several plasma vessels and the wafer queuing station without atmospheric or other exposure so that possible contamination of the moved wafers is prevented. The system is selectively operative in either single-step or multiple-step processing modes, and in either of the modes, the several plasma etching vessels are operable to provide a desirably high system throughput. Wafer processing in each vessel is regulated by a state controller for processing a plurality of wafers from a single cassette, contained within the vacuum environment of the plural plasma etching vessels and wafer queuing station, to provide an orderly and efficient throughput of wafers for diverse or similar processing in the plural vessels. The wafer transfer arm is movable in R and .theta..

Abstract: A system for multichamber processing of semiconductor wafers providing flexibility in the nature of processing available in a multi processing facility. To accommodate changing processing demands and chamber replacement, a mobile processing chamber selectively docks with a multiple chamber system to form one of its processing chambers. The capabilities of the multiprocessing multichamber system are enhanced by extending the system to other multichamber systems through intermediate buffer storage wafer cassette and elevator systems. The extending multichamber system is further provided with intermediate access wafer storage elevator cassettes.