Abstract: A depth estimation system can use a guided filter to enhance depth estimation using brightness image. Light is projected onto an object. The object reflects at least a portion of the projected light. The reflected light is at least partially captured by an image sensor. The depth estimation system may generate a depth image based on a phase shift between the captured light and the projected light and generate a brightness image based on brightness of the captured light. The depth estimation system may use the guided filter to identify a pixel that represents at least a portion of a boundary of the object. The guided filter can determine a depth value of the pixel based on the value of the corresponding pixel in the brightness image. The depth estimation system can assign the depth value to the pixel and generates an enhanced depth image.

Abstract: A balloon catheter is disclosed including a “no-fold” balloon at a distal end thereof that surrounds a distal portion of a guidewire shaft having a compliant shaft or tubular section for selectively gripping a guidewire there within. Upon introduction of inflation fluid at low pressure values, the compliant shaft section of the guidewire shaft is radially compressed to “lock” onto the guidewire while an outer diameter of the no-fold balloon remains unchanged. The simultaneous compression of the compliant shaft section against a guidewire located within the guidewire lumen and the filling of the balloon with inflation fluid without expanding the balloon provides a clinician with a conjoined balloon catheter and guidewire ensemble that together may be pushed through a tight stenosis such as a chronic total occlusion (CTO).

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A medical device for stenting within a patient's vascular system is a low profile fixed-wire balloon catheter. The balloon is not attached directly to the wire-like structure of the catheter, providing a degree of independent rotation therebetween.

Abstract: A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.

Abstract: A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Abstract: A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.