Patents by Inventor Joseph O. DeAngelo
Joseph O. DeAngelo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11882446Abstract: A network access credential change request is received onto a network access credential updating system. The network access credential change request is a request to update access credentials of a network near a vehicle charge station. The new credential in the request is communicated to an electric vehicle. The network is updated with the network access credential. The vehicle is able to connect to the network with the updated credential after the network has been updated. In one embodiment, the network access credential updating system includes an application. A charge station operating entity communicates a network access credential change request for a particular network to the application. After sending the request, the charge station operating entity updates the network access credential for the network in accordance with a credential update agreement. The credential update agreement tends to afford adequate opportunity for vehicles to receive updated credentials before networks are updated.Type: GrantFiled: July 22, 2021Date of Patent: January 23, 2024Assignee: Motiv Power Systems, Inc.Inventors: James Michael Castelaz, Joseph O. DeAngelo
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Patent number: 11495570Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).Type: GrantFiled: February 3, 2022Date of Patent: November 8, 2022Assignee: Kulicke and Soffa Industries, Inc.Inventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo
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Publication number: 20220157771Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).Type: ApplicationFiled: February 3, 2022Publication date: May 19, 2022Inventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo
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Patent number: 11276666Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).Type: GrantFiled: June 13, 2019Date of Patent: March 15, 2022Assignee: Kulicke and Soffa Industries, Inc.Inventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo
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Publication number: 20190295983Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).Type: ApplicationFiled: June 13, 2019Publication date: September 26, 2019Inventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo
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Patent number: 10361168Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).Type: GrantFiled: October 11, 2016Date of Patent: July 23, 2019Assignee: KULICKE AND SOFFA INDUSTRIES, INCInventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo
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Publication number: 20170033077Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).Type: ApplicationFiled: October 11, 2016Publication date: February 2, 2017Inventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo
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Patent number: 9496240Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).Type: GrantFiled: May 17, 2010Date of Patent: November 15, 2016Assignee: Kulicke and Soffa Industries, Inc.Inventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo
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Patent number: 9130093Abstract: A method of assembling a matrix of photovoltaic cells includes positioning photovoltaic cells in a desired orientation, aligning the row of photovoltaic cells relative to each other, and enabling a homogeneous downward pressure on the row of photovoltaic cells to facilitate electrical and mechanical connectivity between the photovoltaic cells.Type: GrantFiled: August 31, 2011Date of Patent: September 8, 2015Assignee: ALTA DEVICES, INC.Inventors: Joseph O. DeAngelo, Sara Kieu Lesperance, Kasiraman Krishnan
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Publication number: 20130052770Abstract: A method of assembling a matrix of photovoltaic cells includes positioning photovoltaic cells in a desired orientation, aligning the row of photovoltaic cells relative to each other, and enabling a homogeneous downward pressure on the row of photovoltaic cells to facilitate electrical and mechanical connectivity between the photovoltaic cells.Type: ApplicationFiled: August 31, 2011Publication date: February 28, 2013Applicant: ALTA DEVICES, INC.Inventors: Joseph O. DeAngelo, Sara Kieu Lesperance, Kasiraman Krishnan
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Publication number: 20120065761Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).Type: ApplicationFiled: May 17, 2010Publication date: March 15, 2012Applicant: KULICKE AND SOFFA INDUSTRIES, INC.Inventors: Ivy Wei Qin, Ray L. Cathcart, Cuong Huynh, Deepak Sood, Paul W. Sucro, Joseph O. DeAngelo