Abstract: A method for manufacturing a display element comprising a plurality of pixels, each comprising a plurality of sub-pixels. The method comprises undertaking, using a pick up tool, a first placement cycle (1908) comprising picking up a plurality of first, untested LED dies and placing them on a display substrate at locations corresponding to the plurality of pixels, testing (1912) the first LED emitters on the display substrate to determine one or more locations of non-functional first LED emitters, selecting one or more second tested LED dies based on a result of the test, configuring the selected one or more second LED dies to enable their pick up and placement on the display substrate and undertaking, using the PUT, a second placement cycle (2008) comprising picking up the selected one or more second LED dies and placing them on the display substrate at the determined locations of the non-functional first LED emitters.

Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.

Abstract: Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.

Abstract: A method for manufacturing a display element comprising a plurality of pixels, each comprising a plurality of subpixels. The method comprises undertaking, using a pick up tool, a first placement cycle (1908) comprising picking up a plurality of first, untested LED dies and placing them on a display substrate at locations corresponding to the plurality of pixels, testing (1912) the first LED emitters on the display substrate to determine one or more locations of non-functional first LED emitters, selecting one or more second tested LED dies based on a result of the test, configuring the selected one or more second LED dies to enable their pick up and placement on the display substrate and undertaking, using the PUT, a second placement cycle (2008) comprising picking up the selected one or more second LED dies and placing them on the display substrate at the determined locations of the nonfunctional first LED emitters.

Abstract: Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.

Abstract: An image generator for use in a display device, the image generator comprising: a plurality of ILED array chips each comprising a plurality of ILED emitters and arranged in an array such that each of a plurality of pixels of the image generator comprises an ILED emitter from each of a plurality of adjacent ILED array chips. The total area of ILED emitter material may be less than 50% of the area of each pixel. The image generator may comprise secondary optics in optical communication with an output of the plurality of ILED emitters of an ILED array chip and configured to direct light from the ILED emitters towards an emission region of the associated pixel.

Abstract: A display (100) comprising a plurality of LED chips (604), each LED chip (604) comprising a plurality of light emitting elements (606a-c). Each LED chip (604) is arranged such that a first light emitting element (606a) is configured to illuminate a sub-pixel, and a second light emitting element (606b) is configured to illuminate a sub-pixel using substantially the same wavelength of light as the first light emitting element. There is also described an LED chip, a display pixel, a controlling method, a computer device and a computer program for a display.

Abstract: A sub-pixel for an LED display, the sub-pixel comprising a first light emitting device having a first emission beam angle and a second light emitting device having a second beam angle, the second emission beam angle being different to the first emission beam angle. There is also described a display using a plurality of the sub-pixels.

Abstract: A method of fabricating an image generator for use in a display, the method comprising: fabricating a plurality of discrete ILED array chips comprising a plurality of ILED emitters configured to produce light having the same wavelength, and wherein each of the plurality of ILED array chips is configured to produce light having one of a plurality of wavelengths; positioning the plurality of discrete ILED array chips on a carrier substrate such that a plurality of ILED emitters from adjacent chips form a pixel of a display; and bonding a first surface of the plurality of ILED array chips to a driver backplane such that electrical contacts of the plurality of ILED array chips are in electrical communication with the driver back-plane, wherein the driver backplane comprises electronics for driving the ILED array chips.

Abstract: Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.

Abstract: Methods and apparatus for use in the manufacture of a display device including pixels. Each pixel includes a plurality of sub-pixels, each sub-pixel configured to provide light of a given wavelength. The method may include: performing, using a pick up tool (PUT), a first placement cycle comprising picking up first light emitting diode (LED) dies, and placing a first LED die on a substrate of the display device at a location corresponding to a sub-pixel the display device. The method further includes performing one or more subsequent placement cycles comprising picking up a second LED die, and placing the second LED die on the substrate of the display device at a second location corresponding to the sub-pixel of the display device. Multiple first and second LED dies may be picked and placed during each placement cycle to populate each pixel of the display device to provide redundancy of LED dies at each sub-pixel.

Abstract: Systems and methods can provide for packet-rate policing and admission control with optional stress throttling. In some implementations, a broadband device can monitor bandwidth usage and respond after exceeding a maximum packet-rate threshold based on a per-channel basis. In other implementations, a broadband device can monitor bandwidth usage and respond after exceeding a maximum packet-rate threshold based on a per-service-flow basis. In additional implementations, a broadband device processor can feedback data to the packet-rate policer to throttle the packet rate based on processor utilization. Policing data traffic based on packet-rate instead of bandwidth can increase flexibility to service providers as an increasing number of services are deployed to users.

Abstract: Systems and methods can operate to improve the communication bandwidth in communication systems. Communication systems can use new forward error correction (FEC) algorithms to increase communication bandwidth. New FEC algorithms can also enable the use of other modulation formats to further improve communication bandwidth. Communication devices that can select from a plurality of FEC algorithms and modulation formats can maintain backward compatibility with the deployed FEC algorithms and modulation formats implemented in legacy communication devices while realizing increased communication bandwidth.

Abstract: A database statement categorization system can enable DBAs or other users to more easily find tunable database statements by categorizing the database statements. The database categorization system can analyze a DBMS to identify the types of database statements executed on the DBMS and can then categorize the statements automatically, outputting the categorization for presentation to a DBA (or other user). This categorization can advantageously separate less relevant statements that warrant less tuning or investigation from more relevant statements that may have a measurable impact on the performance of the database. By allowing users to focus on statements that are more likely to warrant attention, in certain embodiments the database categorization system streamlines the tuning process.

Abstract: Methods, systems, and apparatuses can provide a plurality of RF channels and outputs using digital modulation and combining. In various examples, generation of digital IQ packetized data in combination with digital switching can increase the number of RF modulated channels, optimize broadcast transmission and/or provide transmission resiliency.

Abstract: A database statement categorization system can enable DBAs or other users to more easily find tunable database statements by categorizing the database statements. The database categorization system can analyze a DBMS to identify the types of database statements executed on the DBMS and can then categorize the statements automatically, outputting the categorization for presentation to a DBA (or other user). This categorization can advantageously separate less relevant statements that warrant less tuning or investigation from more relevant statements that may have a measurable impact on the performance of the database. By allowing users to focus on statements that are more likely to warrant attention, in certain embodiments the database categorization system streamlines the tuning process.

Abstract: A closed loop controller (6) has a measurement server (11) which captures measurement data from a measurement machine (3) via a link (22). It also receives production data indicating which placement machine parts were involved in depositing inspected items, via links (20, 21). The server (11) correlates this data and transmits it via a link (23) to a closed loop client (10), which generates process engineer displays of the correlated data and generates a control signal for the placement machine (2). These are fed back via a link (24) for automatic closed loop control.

Abstract: A closed loop controller (6) has a measurement server (11) which captures measurement data from a measurement machine (3) via a link (22). It also receives production data indicating which placement machine parts were involved in depositing inspected items, via links (20, 21). The server (11) correlates this data and transmits it via a link (23) to a closed loop client (10), which generates process engineer displays of the correlated data and generates a control signal for the placement machine (2). These are fed back via a link (24) for automatic closed loop control.