Abstract: There is disclosed for use with a piezoelectric stack, first and second side electrodes, each side electrode having two serpentine shape members positioned in a common plane, where the two serpentine shape members of an electrode have alternately spaced conductive fingers which project outward toward each other. The conductive fingers are adapted to be electrically coupled to the ends of alternate ones of internal electrode layers of the piezoelectric stack. The undersides of the conductive fingers which contact the ends of the internal electrodes are provided with a solder material to provide good electrical contact by applying the soldered finger to the internal electrode and applying heat to reflow the solder. The serpentine shape of the side electrodes here disclosed provides high flexibility which can absorb displacement of the internal electrodes as they move up, down, in and out as the piezoelectric layers of the stack expand and contract.

Abstract: There is disclosed for use with a piezoelectric stack, first and second side electrodes, each side electrode having two serpentine shape members positioned in a common plane, where the two serpentine shape members of an electrode have alternately spaced conductive fingers which project outward toward each other. The conductive fingers are adapted to be electrically coupled to the ends of alternate ones of internal electrode layers of the piezoelectric stack. The undersides of the conductive fingers which contact the ends of the internal electrodes are provided with a solder material to provide good electrical contact by applying the soldered finger to the internal electrode and applying heat to reflow the solder. The serpentine shape of the side electrodes here disclosed provides high flexibility which can absorb displacement of the internal electrodes as they move up, down, in and out as the piezoelectric layers of the stack expand and contract.

Abstract: An electronic stack module is disclosed comprising two or more substrates having upper and lower surfaces with one or more electronic components disposed on the surfaces and electrically connected to connector pads disposed in a predetermined pattern at the substrate edges. A plurality of clip leads are electrically attached to the connector pads, where each clip lead comprises a clip section, a standoff section of specified length, and a mounting section, the clip section configured to frictionally engage both upper and lower substrate surfaces. Stacking of substrates is accomplished by aligning and bonding clip sections of one substrate to corresponding mating sections of the adjacent substrate.