Abstract: A method of producing a multi-level electronic device that begins with machining into a sheet of dielectric material from a surface to create a set of first indentations at a first level. Conductive material is then deposited into the first indentations to create a set of first conductive features. The first indentations are then substantially filled with dielectric material. The process is continued by machining again into the sheet of dielectric material from a surface and thereby creating a set of second indentations at a second level. Further conductive material is deposited into the second indentations to create a set of second conductive features.

Abstract: A laminated multi-electrode biocompatible implant, comprising a first layer of flexible, biocompatible dielectric material having a first, exposed surface. A second layer of flexible biocompatible dielectric material, is adhered to the first layer. Further, a third layer of flexible biocompatible dielectric material is adhered to the second layer. Additionally, a first conductive trace is interposed between the first layer and the second layer and a second conductive trace interposed between said second layer and said third layer. Finally, a first conductor, which breaches said first layer, conductively connects the first conductive trace to the exposed surface of the first layer, thereby forming a first electrode and a second conductor, which breaches the first layer and the second layer, conductively connects the second conductive trace to the exposed surface of the first layer, thereby forming a second electrode.

Abstract: A bio-implant having a length and a proximal and a distal end. The bio-implant has at least two lamina of dielectric material joined together, thereby defining a boundary and also defining a side surface that is intersected by this boundary. In addition, at least one set of conductors is interposed between the two lamina and extend lengthwise from the proximal end toward the distal end, each one of the set of conductors being terminated adjacent to the side surface to form a set of conductor terminations. Further, a set of electrode contact points are constructed on the side surface, with each electrode contact point contacting one of said conductor terminations.