Abstract: A novel electron beam apparatus window having improved cooling associated therewith, which is in the form of heat pipes located on the window of such apparatus for the cooling of such window by such heat pipes, whereby the heat pipes eliminate the need for air cooling and thus eliminate the production of ozone.

Abstract: Films of thermoplastic material may be sealed together by application of a radio frequency field through a pair of oppositely positioned electrodes. Preferred thermoplastic materials have a low dielectric dissipation factor, and such materials include polyethylene. The sealing apparatus includes a circuit having compensation and matching circuits for providing resonant operation and minimizing the amount of reflected energy from the electrodes. Through the use of this invention effective RF sealing is produced-between films of thermoplastic material having a low dielectric dissipation factor. Further the sealing apparatus preferably includes at least one electrode coated with a ceramic and a release material for providing thermal conduction to the films, thereby enhancing the sealing effectiveness of the apparatus.

Abstract: Disclosed is a thermoplastic polymeric composition having antistatic characteristics and a method to make same. The composition comprises a thermoplastic polymer in admixture with an antistatic agent. In one embodiment the polymer is nylon 12 and the agent is N-butyl benzenesulfonamide. Also disclosed is the antistatic polymeric composition in a film, which is useful for packaging static sensitive devices such as electronic circuit boards, or for packaging devices that must be protected from static electricity such as devices in a medical operating room where explosive oxygen and/or ether are present.

Abstract: Disclosed is a thermoplastic polymeric composition having antistatic characteristics and a method to make same. The composition comprises a thermoplastic polymer in admixture with an antistatic agent. In one embodiment the polymer is nylon 12 and the agent is N-butyl benzenesulfonamide. Also disclosed is the antistatic polymeric composition in a film, which is useful for packaging static sensitive devices such as electronic circuit boards, or for packaging devices that must be protected from static electricity such as devices in a medical operating room where explosive oxygen and/or ether are present.