Abstract: An MCM-HIC device flexibly adds enhanced features to a VLSI “core” IC that are not directly supported by the core IC, such as unsupported communication protocols and/or support of cold spare operation. The core IC is mounted on an interconnecting substrate together with at least one “chiplet” that provides the required feature(s). The chiplet can be programmable. The chiplet can straddle a boundary of an interposer region of the substrate that provides higher density interconnections at lower currents. The disclosed method can include selecting a core IC and at least one active, passive, or “mixed” chiplet, configuring a substrate, and installing the core IC and chiplet(s) on the substrate. In embodiments, the core IC and/or chiplet(s) can be modified before assembly to obtain the desired result. Cost can be reduced by pre-designing and, in embodiments, pre-manufacturing the chiplets and modified core ICs in cost-effective quantities.

Abstract: An MCM-HIC device flexibly adds enhanced features to a VLSI “core” IC that are not directly supported by the core IC, such as unsupported communication protocols and/or support of cold spare operation. The core IC is mounted on an interconnecting substrate together with at least one “chiplet” that provides the required feature(s). The chiplet can be programmable. The chiplet can straddle a boundary of an interposer region of the substrate that provides higher density interconnections at lower currents. The disclosed method can include selecting a core IC and at least one active, passive, or “mixed” chiplet, configuring a substrate, and installing the core IC and chiplet(s) on the substrate. In embodiments, the core IC and/or chiplet(s) can be modified before assembly to obtain the desired result. Cost can be reduced by pre-designing and, in embodiments, pre-manufacturing the chiplets and modified core ICs in cost-effective quantities.

Abstract: A method for providing a power estimation for an electronic system is disclosed. Initially, a system architecture of an electronic system design is initially developed, and the system architecture of the electronic system design is then converted to a power flow architecture of the electronic system design. For each power domain within the power flow architecture of the electronic system design, a power domain type is designated. Subsequently, power information are added to the power flow architecture of the electronic system. Finally, a power roll-up calculation is performed on the power flow architecture of the electronic system design in order to yield a final system power value for the electronic system design.

Abstract: A universal support device for supporting a reconfigurable electronics device is disclosed. The universal support device includes an application specific integrated circuit (ASIC) module coupled to multiple non-volatile memory devices. The ASIC module is capable of interfacing with an external reconfigurable electronics device via a set of load/read-back interface lines and sense mitigation lines. The load/read-back interface lines are capable of being programmed to provide a parallel or a serial load and/or store protocols. The sense mitigation line can sense conditions that indicate a single-event functional interrupt or a radiation-induced event occurred within the reconfigurable electronics device.

Abstract: A universal support device for supporting a reconfigurable electronics device is disclosed. The universal support device includes an application specific integrated circuit (ASIC) module coupled to multiple non-volatile memory devices. The ASIC module is capable of interfacing with an external reconfigurable electronics device via a set of load/read-back interface lines and sense mitigation lines. The load/read-back interface lines are capable of being programmed to provide a parallel or a serial load and/or store protocols. The sense mitigation line can sense conditions that indicate a signal-event functional interrupt or a radiation-induced event occurred within the reconfigurable electronics device.

Abstract: A computer device includes an interface board, a plurality of peripheral component interface (PCI) busses on the interface board, and a plurality of device card connectors carried by the interface board. The plurality of device card connectors include at least one first device card connector coupled to first and second PCI busses synchronous with one another, and at least one second device card connector coupled to the second PCI bus and to a third PCI bus asynchronous with the second PCI bus. The PCI busses are thus connected so that the PCI busses may be added in groups according to the number of device card connectors supported by the interface board, and not by the loading constraints of the PCI busses themselves. By defining both synchronous and asynchronous device card connectors, device cards requiring either synchronous or asynchronous communications may be utilized by the computer device.