Patents by Inventor Joseph S. Barnes
Joseph S. Barnes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8576599Abstract: A multi-wafer CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-wafer CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the inventive CAM cell can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-wafer CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays.Type: GrantFiled: February 2, 2012Date of Patent: November 5, 2013Assignee: International Business Machines CorporationInventors: Jagreet S. Atwal, Joseph S. Barnes, Kerry Bernstein, Robert J. Bucki, Jason A. Cox
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Patent number: 8513791Abstract: A multi-ported CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-ported CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the multi-port CAM can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-port CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays. Each compare match line and data bit line has the length associated with a simple two-dimensional Static Random Access Memory (SRAM) cell array.Type: GrantFiled: May 18, 2007Date of Patent: August 20, 2013Assignee: International Business Machines CorporationInventors: Robert J. Bucki, Jagreet S. Atwal, Joseph S. Barnes, Kerry Bernstein, Eric Robinson
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Patent number: 8343814Abstract: A multi-ported CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-ported CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the multi-port CAM can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-port CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays. Each compare match line and data bit line has the length associated with a simple two-dimensional Static Random Access Memory (SRAM) cell array.Type: GrantFiled: August 17, 2009Date of Patent: January 1, 2013Assignee: International Business Machines CorporationInventors: Robert J. Bucki, Jagreet S. Atwal, Joseph S. Barnes, Kerry Bernstein, Eric Robinson
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Publication number: 20120127771Abstract: A multi-wafer CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-wafer CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the inventive CAM cell can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-wafer CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays.Type: ApplicationFiled: February 2, 2012Publication date: May 24, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jagreet S. Atwal, Joseph S. Barnes, Kerry Bernstein, Robert J. Bucki, Jason A. Cox
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Publication number: 20090305462Abstract: A multi-ported CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-ported CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the multi-port CAM can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-port CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays. Each compare match line and data bit line has the length associated with a simple two-dimensional Static Random Access Memory (SRAM) cell array.Type: ApplicationFiled: August 17, 2009Publication date: December 10, 2009Applicant: International Business Machines CorporationInventors: Robert J. Bucki, Jagreet S. Atwal, Joseph S. Barnes, Kerry Bernstein, Eric Robinson
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Publication number: 20080291767Abstract: A multi-port register file (e.g., memory element) is provided in which each read port of the register file is located in a separate wafer above and/or below the primary data storage element. This is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stacked and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stacked layer.Type: ApplicationFiled: May 21, 2007Publication date: November 27, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Joseph S. Barnes, Jagreet S. Atwal, Kerry Bernstein, Robert J. Bucki
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Publication number: 20080283995Abstract: A multi-ported CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-ported CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the multi-port CAM can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-port CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays. Each compare match line and data bit line has the length associated with a simple two-dimensional Static Random Access Memory (SRAM) cell array.Type: ApplicationFiled: May 18, 2007Publication date: November 20, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Robert J. Bucki, Jagreet S. Atwal, Joseph S. Barnes, Kerry Bernstein, Eric Robinson
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Publication number: 20080288720Abstract: A multi-wafer CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-wafer CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the inventive CAM cell can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-wafer CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays.Type: ApplicationFiled: May 18, 2007Publication date: November 20, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jagreet S. Atwal, Joseph S. Barnes, Kerry Bernstein, Robert J. Bucki, Jason A. Cox