Abstract: Described are ion implantation devices, systems, and methods, and in particular to an ion source that is useful for generating an aluminum ion beam.

Abstract: A transaction record is created showing a purchase transaction of a customer. A CV profile showing a list of items in the transaction obtained from images is also obtained. The items in the transaction record are compared to items on the list. When there is a discrepancy, an action to take is determined.

Abstract: Compounds that inhibit KRas G12D. In particular, compounds that inhibit the activity of KRas G12D, pharmaceutical compositions comprising the compounds and methods of use therefor, and in particular, methods of treating cancer. The compounds have a general structure represented by Formula (I): or a pharmaceutically acceptable salt thereof.

Abstract: The present invention relates to compounds that inhibit KRas G12C. In particular, the present invention relates to compounds that irreversibly inhibit the activity of KRas G12C, pharmaceutical compositions comprising the compounds and methods of use therefor.

Abstract: An endoscopic deployment device includes a body mountable on an endoscopic device, a communication interface, and a motor. The body has a movable carrier couplable to an elongated end effector device. The effector device has an end effector shaft covered by an outer sheath and an end effector extending from a distal end of the shaft. The sheath is sized and shaped for insertion through a working channel of an endoscopic shaft of the endoscopic device. The body has a carrier channel sized for the carrier to slide therein. The end effecter is actuatable between open and closed positions by sliding the carrier in the carrier channel which in turn slides the sheath over the end effector shaft to uncover/cover the end effector. Rotation of a drive shaft of the motor is sliding the carrier in the carrier channel and actuating the end effector in response to a signal.

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

Abstract: The present invention generally relates to the field of prostheses for surgical applications, to methods of their manufacturing and to methods of treating a patient by implanting them into a patient. More particularly, the present invention relates to prostheses having a multi-layered sheet structure and their use in hernia repair, the repair of anatomical defects of the abdominal wall, diaphragm, and chest wall, correction of defects in the genitourinary system, and repair of traumatically damaged organs such as the spleen, liver or kidney.

Abstract: A system, method, device, and apparatus provide a dielectric waveguide splitter/bi-directional link. A dielectric substrate fabricated into a first Y-junction waveguide with a first port splitting into a first branch leading to a second port and a second branch leading to a third port. An angle between the first branch and the second branch is below ninety degrees (90°). The dielectric waveguide splitter enables millimeter-wave (mmWave) transmission between the first port and the second port while reducing feedback of the mmWave between the second and third port. Two Y-junction waveguides may be fabricated back-to-back to provide simultaneous bidirectional mmWave transmission at a single frequency.

Abstract: A laparoscopic tool, the tool including an elongate shaft; a handle at one end of the shaft and an aperture at the opposed end, and; a tape selectively extendable from the aperture.

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

Abstract: A system, method, device, and apparatus provide a dielectric waveguide splitter/bi-directional link. A dielectric substrate fabricated into a first Y-junction waveguide with a first port splitting into a first branch leading to a second port and a second branch leading to a third port. An angle between the first branch and the second branch is below ninety degrees (90°). The dielectric waveguide splitter enables millimeter-wave (mmWave) transmission between the first port and the second port while reducing feedback of the mmWave between the second and third port. Two Y-junction waveguides may be fabricated back-to-back to provide simultaneous bidirectional mmWave transmission at a single frequency.

Abstract: The present invention generally relates to the field of prostheses for surgical applications, to methods of their manufacturing and to methods of treating a patient by implanting them into a patient. More particularly, the present invention relates to prostheses having a multi-layered sheet structure and their use in hernia repair, the repair of anatomical defects of the abdominal wall, diaphragm, and chest wall, correction of defects in the genitourinary system, and repair of traumatically damaged organs such as the spleen, liver or kidney.

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

Abstract: The invention relates to prostheses having a multi-layered sheet structure comprising at least two continuous polymer film layers. Also disclosed are methods of manufacturing the prostheses, as well as methods of treating a patient by implanting them into a patient. The prostheses are used in hernia repair, the repair of anatomical defects of the abdominal wall, diaphragm and chest wall, correction of defects in- the genitourinary system, and repair of traumatically damaged organs such as the spleen, liver or kidney.

Abstract: High speed connector inserts and cables having improved heat conduction, high strength, and may be manufactured in a reliable manner. One example may provide a connector insert having several paths by which heat may be removed from circuitry in the cable insert. In one example, heat may be removed from one or more circuits by forming a thermal path between a circuit and a shield of the connector insert. Another path may include one or more pads on a side of an integrated circuit board that are soldered directly to the shield. A braiding surrounding a cable may be soldered or otherwise thermally connected to the shield. Another example may provide a cable having a braiding that includes one or more types of fibers, such as aramid fibers. Another example may provide for increased manufacturability by using a wire comb and a solder bar.

Abstract: An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.

Abstract: A cable connector assembly (100) in accordance with the present invention includes a printed circuit board (2) having a number of signal and ground pads (25, 26) alternatively arranged at opposite front and rear ends (21, 22) thereof, a conductive wire organizer (3) including a body portion (30) defining a number of through holes (300) and a number of ground plates (31) integrally extending forwardly from the body portion to electrically connecting with the ground pads of the printed circuit board, and a number of wires (4) protruding through the through holes of the wire organizer. Each wire includes at least one signal conductor (40) soldered with the signal pad of the printed circuit board, an insulator (41) enclosing the at least one signal conductor and a conductor layer (42) enclosing the insulator and electrically connecting with the wire organizer.

Abstract: A cable connector assembly (100) includes a printed circuit board (2) having a number of signal and ground pads (25, 26) alternatively arranged at opposite front and rear ends thereof, a wire organizer (3) defining a number of through holes (30), a unitary grounding member (6) assembled to the wire organizer and including a number of grounding plates (62) integrally formed therewith to electrically connect with the ground pads of the printed circuit board, and a number of wires (4) protruding through the through holes of the wire organizer. Each wire includes at least one signal conductor (40) soldered with the signal pad of the printed circuit board, an insulator (41) enclosing the at least one signal conductor and a ground conductor (43) electrically connecting with the grounding member to form ground path with the printed circuit board.