Abstract: A laser assisted tile cutting device consists of a base section, cutting unit, a laser beam emitting unit, a pair of guide rails, a sliding mechanism, a first mounting pad, and a second mounting pad. The first mounting pad and the second mounting pad, which are aligned parallel to each other, are perpendicularly mounted onto the base section. The pair of guide rails extend from the first mounting pad to the second mounting pad. The cutting unit is slidably positioned along the pair of guide rails via the sliding mechanism. The laser beam emitting unit generates a guided path for the cutting unit to follow. By following the guided path, accurate linear cuts and angular cuts can be obtained.