Abstract: A method of closing a mold and a press therefore, whereby a first mold part is moved towards a second mold part by a first relatively large displacement via a mechanical non-fluid drive. The mold parts are then pressed against one another by a fluid system including a pneumatically driven hydraulic system to provide relative high mold pressures. Drive and follower pins are selectively coupled to the hydraulic system by a carousel for selectively coupling a mold part to the hydraulic system during the pressing portion of the cycle. The method and press are particularly suitable for encapsulating electrical components.

Abstract: A method of closing a mold and a press therefore, whereby a first mold part is moved towards a second mold part by a first relatively large displacement via a mechanical non-fluid drive. The mold parts are then pressed against one another by a fluid system including a pneumatically driven hydraulic system to provide relative high mold pressures. Drive and follower pins are selectively coupled to the hydraulic system by a carousel for selectively coupling a mold part to the hydraulic system during the pressing portion of the cycle. The method and press are particularly suitable for encapsulating electrical components.

Abstract: A device for simultaneously encapsulating a number of electronic components is provided with a locking mechanism in which a molding cycle has two phases, i.e. in a first transfer phase, during which plungers for injecting molten resin into encapsulation cavities are locked and driven at a high, controlled speed, followed by a second curing phase, during which the plungers are spring-loaded, unlocked, and stationary, and are subject to the same maximum pressure of the transfer phase. In this way damage to the products is prevented, while the cycle time is reduced and the products obtained have an even and smooth appearance.