Abstract: A method places a component at a desired position on a substrate by means of a placement device. The component is transported to an intermediate position above the desired position and a position difference between the intermediate position and the desired position is determined by means of a camera and a processor. Subsequently, the component is transported to the desired position on the substrate, making use of the position difference. The camera, which is arranged at the side of the component opposite the component's side facing the substrate, takes an image of at least the portion of the substrate that includes the desired position as well as the placement device.

Abstract: A method and placement device are provided for moving at least two elements in and opposite to a predetermined direction. The second element is simultaneously moved by means of the first element. The first element is moved in the predetermined direction, whereas the second element is moved relative to the first element in a direction opposite to the predetermined direction and vice versa.

Abstract: By means of a method, at least one component is placed on at least one substrate. The component is picked-up by at least one placement machine and is placed at a desired position on the substrate. After the component is placed on the substrate, an image of the component placed on the substrate is taken by a camera. Any difference between the actual position of the component on the substrate and a desired position of the component on the substrate is established on account of the image. The positioning of another component to be placed on the substrate takes into account any such difference.

Abstract: A component placement device includes at least two component pick and place units, which are connected to a movable frame, and at least two component feeding devices. The component placement device is suitable for simultaneously picking-up components supplied, by means of the component feeding devices, by means of the component pick and place units. At least one component pick and place unit can be moved relative to the frame, which permits adjustment of the positions of the component pick and place units relative to one another.

Abstract: A method and device are provided for placing components in a desired position on at least one substrate. The device includes a movable arm on which at least two image recording device are provided and separated by a predetermined pitch distance. In addition, two placement devices, which are separated by the same pitch distance, are also present on the arm. The spacing between the image recording devices and the placement devices is one pitch distance or a multiple thereof. A picture may be taken of at least one reference element present on a substrate by at least one image recording device, and simultaneously therewith a component may be placed on a substrate by at least one placement device.

Abstract: The invention relates to a positioning device with an X-beam (6) and two parallel Y-beams (2,3) in the shape of an H. On each Y-beam a motor driven carriage (4,5) is provided. Between these carriages an X-beam is coupled. On the X-beam a carriage (9) with a positioning head (10) is provided. The coupling (7) between one end of the X-beam and the carriage (4) on the first Y-beam (2) comprises two leaf springs (19,20) perpendicular to each other, the intersecting line of said leaf springs forming an imaginary rotation axis (28) of the coupling. The coupling (8) between the other end of the X-beam and the carriage (5) on the other, second Y-beam (3) comprises one leaf spring (29) oriented in the Y-direction and having a relatively great stiffness in the Y-direction and a relative small stiffness in the X-direction. Advantage of these couplings: no play, frictionless, possibility of small angle correction for the positioning head.

Abstract: A method of positioning a printed circuit board in a component placement machine and holding it in a plane condition. The exertion of a couple on two mutually opposed edge portions of a printed circuit board presses the printed circuit board flat onto a support.

Abstract: A rod magazine for electrical and/or electronic components, more particularly for air coils, comprising a rod-shaped holder comprising a magazine chamber of U-shaped cross-section and a component support needle cantilevered from the holder at one needle end and extending freely through the magazine chamber throughout its length.

Abstract: A device for feeding electronic components packed in tape to a pick-up position, comprising a housing with a holder or a supply reel, a feeding and locking mechanism, an ejection mechanism, and a wind-up mechanism, which mechanisms are united with the housing into a cassette unit.

Abstract: A device for applying a fixing medium to electronic chip-type components, comprising a container with a number of stamps arranged in one row and displaceable in vertical direction. Each of these stamps consists of a stamp pin which is identical for all stamps, and an exchangeable attachment with a stamp head adapted to the components. The container is closed on the upper side by a cover plate provided with holes, on which exchangeable and displaceable supporting plates are mounted by means of magnets, each supporting plate comprising several openings adapted to the components. The cover plate and the supporting plates have guides and positioning means for positioning the supporting plates with respect to the stamps.