Patents by Inventor Josh Woodland

Josh Woodland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DRY FLUX BONDING DEVICE AND METHOD
    Publication number: 20130299868
    Abstract: Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.
    Type: Application
    Filed: July 17, 2013
    Publication date: November 14, 2013
    Inventors: Owen Fay, Xiao Li, Josh Woodland, Shijian Luo, Jaspreet Gandhi, Te-Sung Wu
  • Dry flux bonding device and method
    Patent number: 8492242
    Abstract: Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: July 23, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Owen Fay, Xiao Li, Josh Woodland, Shijian Luo, Jaspreet Gandhi, Te-Sung Wu
  • DRY FLUX BONDING DEVICE AND METHOD
    Publication number: 20110291146
    Abstract: Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.
    Type: Application
    Filed: May 25, 2010
    Publication date: December 1, 2011
    Applicant: Micron Technology, Inc.
    Inventors: Owen Fay, Xiao Li, Josh Woodland, Shijian Luo, Jaspreet Gandhi, Te-Sung Wu