Patents by Inventor Joshua Chin-Wing Tsui

Joshua Chin-Wing Tsui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic chuck with an impregnated, porous layer that exhibits the Johnson-Rahbeck effect
    Patent number: 5916689
    Abstract: An electrostatic chuck including a pedestal having a conductive upper surface; and a layer of plasma-sprayed material formed on the upper surface of the pedestal and defining a surface onto which a substrate is placed during use, wherein the plasma-sprayed material exhibits the Johnson-Rahbeck effect when a bias is applied between the substrate and the pedestal.
    Type: Grant
    Filed: January 11, 1996
    Date of Patent: June 29, 1999
    Assignee: Applied Materials, Inc.
    Inventors: Kenneth S. Collins, Joshua Chin-Wing Tsui, Douglas Buchberger