Abstract: Optoelectronic packaging assemblies for optically and electrically interfacing a protected electro-optical device or system to both an optical fiber and to external circuitry. Such assemblies are comprised of body components that are comprised of plastic that coated or plated with a conductive material. Electrical contact pins in the form of transmission lines are used to couple external electrical signals with the package. The optoelectronic packaging assemblies are dimensioned with small cavities and with steps, breaks, walls, and/or fins molded into the body components. The optoelectronic packaging assemblies further include an optical input receptacle for receiving an optical ferrule and an optical fiber. The optoelectronic packaging assembly provides for cooling, such as by heat sink fins and/or a thermal-electric-cooler. The transmission line pins and body components are dimensioned to mate with a standardized circuit board having transmission line traces.

Abstract: Optoelectronic packaging assemblies for optically and electrically interfacing a protected electro-optical device or system to both an optical fiber and to external circuitry. Such assemblies are comprised of body components that are comprised of plastic that coated or plated with a conductive material. Electrical contact pins in the form of transmission lines are used to couple external electrical signals with the package. The optoelectronic packaging assemblies are dimensioned with small cavities and with steps, breaks, walls, and/or fins molded into the body components. The optoelectronic packaging assemblies further include an optical input receptacle for receiving an optical ferrule and an optical fiber. The optoelectronic packaging assembly provides for cooling, such as by heat sink fins and/or a thermal-electric-cooler. The transmission line pins and body components are dimensioned to mate with a standardized circuit board having transmission line traces.