Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract: The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The portable computing device can include a case snap system configured to movably attach two portions of a base of the computing device together. The portable computing device can include a lid portion with a support structure having a shaped profile configured to support a display. The portable computing device can include locating features disposed within the base portion configured to locate internal components.

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract: Tools and fixtures for assembling a printed circuit board (PCB), such as a main logic board (MLB), in a portable computer device are described. A connector assembly having an electrically conductive gasket mounted on an edge of the MLB is described. In addition, a keyboard assembly including a notched portion of the MLB for accommodating more than one type of keyboard is described. In addition, a PCB assembly having a bracket to support a weak region of the PCB during assembly is described.

Abstract: A computer system having a loudspeaker mounted on a main logic board by a hermetic seal, is disclosed. More particularly, embodiments of the computer system include an acoustic cavity defined between the loudspeaker, the main logic board, and the hermetic seal. Embodiments of the computer system may include a compressible seal separated from the hermetic seal by the loudspeaker and/or the main logic board. The compressible seal may define an acoustic channel and the loudspeaker may emit sound in a high frequency range through the acoustic channel toward a system exit. Other embodiments are also described and claimed.

Abstract: Tools and fixtures for assembling a printed circuit board (PCB), such as a main logic board (MLB), in a portable computer device are described. A connector assembly having an electrically conductive gasket mounted on an edge of the MLB is described. In addition, a keyboard assembly including a notched portion of the MLB for accommodating more than one type of keyboard is described. In addition, a PCB assembly having a bracket to support a weak region of the PCB during assembly is described.

Abstract: An electronic device is disclosed that redirects light escaping from a display assembly light source to an illuminable region of the electronic device. In some embodiments, the electronic device includes a light guide panel arranged along a rear surface of the display assembly and configured to receive light escaping from a lateral side of the light source. The light guide panel can then be arranged to transport that light to a position behind the illuminable region and emit it back out in a focused beam having a size about the same as the illuminable region. In some embodiments the illuminable region can be a logo or device identifier.

Abstract: Tools and fixtures for assembling a printed circuit board (PCB), such as a main logic board (MLB), in a portable computer device are described. A connector assembly having an electrically conductive gasket mounted on an edge of the MLB is described. In addition, a keyboard assembly including a notched portion of the MLB for accommodating more than one type of keyboard is described. In addition, a PCB assembly having a bracket to support a weak region of the PCB during assembly is described.

Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

Abstract: A computer system having a loudspeaker mounted on a main logic board by a hermetic seal, is disclosed. More particularly, embodiments of the computer system include an acoustic cavity defined between the loudspeaker, the main logic board, and the hermetic seal. Embodiments of the computer system may include a compressible seal separated from the hermetic seal by the loudspeaker and/or the main logic board. The compressible seal may define an acoustic channel and the loudspeaker may emit sound in a high frequency range through the acoustic channel toward a system exit. Other embodiments are also described and claimed.

Abstract: The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.

Abstract: The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.

Abstract: The present application describes various embodiments regarding systems and methods for providing a lightweight and durable portable computing device having a thin profile. The portable computing device can take the form of a laptop computer. The portable computing device can include a case snap system configured to movably attach two portions of a base of the computing device together. The portable computing device can include a lid portion with a support structure having a shaped profile configured to support a display. The portable computing device can include locating features disposed within the base portion configured to locate internal components.

Abstract: Methods, tools and fixtures for assembling a printed circuit board (PCB), such as a main logic board (MLB), in a portable computer device are described. A connector assembly having an electrically conductive gasket mounted on an edge of the MLB is described. In addition, a keyboard assembly including a notched portion of the MLB for accommodating more than one type of keyboard is described. In addition, a PCB assembly having a bracket to support a weak region of the PCB during assembly is described. In addition, a method for shielding an antenna cable situated on an MLB is described.

Abstract: The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.