Abstract: A method includes rotating a wafer at a first speed for a first time duration. The wafer is rotated at a second speed that is lower than the first speed for a second time duration after the first time duration. The wafer is rotated at a third speed that is higher than the second speed for a third time duration after the second time duration. A photoresist is dispensed on the wafer during the first time duration and at least a portion of a time interval that includes the second time duration and the third time duration.

Abstract: In semiconductor fabrication processes, one or more wafers are often exposed to processes such as chemical vapor deposition to form semiconductor components thereupon. Often, some of the wafers exhibit flaws due to contamination or processing errors occurring before, during, or after component formation. Inspection of the wafers is often performed by direct visual inspection of humans, which is prone to errors due to flaws that are too small to view directly; to particles naturally arising in the human eye; and to fatigue caused by inspection of large numbers of wafers. Presented herein are inspection techniques involving positioning the wafer in a dark chamber exposing the surface of the wafer to a light source at a first angle, and capturing with a camera an image of the light source reflected from the surface of the wafer at a second angle. Wafers identified as exhibiting flaws are removed from the wafer set.

Abstract: A method includes rotating a wafer at a first speed for a first time duration. The wafer is rotated at a second speed that is lower than the first speed for a second time duration after the first time duration. The wafer is rotated at a third speed that is higher than the second speed for a third time duration after the second time duration. A photoresist is dispensed on the wafer during the first time duration and at least a portion of a time interval that includes the second time duration and the third time duration.

Abstract: In semiconductor fabrication processes, one or more wafers are often exposed to processes such as chemical vapor deposition to form semiconductor components thereupon. Often, some of the wafers exhibit flaws due to contamination or processing errors occurring before, during, or after component formation. Inspection of the wafers is often performed by direct visual inspection of humans, which is prone to errors due to flaws that are too small to view directly; to particles naturally arising in the human eye; and to fatigue caused by inspection of large numbers of wafers. Presented herein are inspection techniques involving positioning the wafer in a dark chamber exposing the surface of the wafer to a light source at a first angle, and capturing with a camera an image of the light source reflected from the surface of the wafer at a second angle. Wafers identified as exhibiting flaws are removed from the wafer set.