Abstract: A metal/polymeric dielectric substrate has metal conductors selectively disconnected by photoablating the polymeric dielectric with an excimer laser, etching the exposed metal using the polymeric dielectric as a mask, and coating an additional layer of polymeric dielectric. This eliminates the need for depositing and removing a separate photoablatable mask. Siloxane-modified-polyimide is a preferred photoablatable polymeric material and copper is a preferred metal.

Abstract: A method of making an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes depositing an electrically conductive layer on a substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.

Abstract: A method of reworking an electrical multilayer interconnect in which the electrical lines can be protected by an overcoat. The method includes removing a defective metallization layer from the top of an interconnect substrate, depositing an electrically conductive layer on the substrate, forming a base plating mask on the electrically conductive layer, plating a copper base into an opening in the base plating mask onto the electrically conductive layer, stripping the base plating mask, forming a pillar plating mask on top of the copper base, plating an electrically conductive metal pillar into an opening in the pillar plating mask onto the top of the copper base, stripping the plating mask, and stripping the electrically conductive layer below the stripped base plating mask. Additionally, a protective overcoat layer can be deposited on the exposed copper surfaces.

Abstract: Forming an electrical interconnect by applying an adhesion layer over a substrate, applying an electrical conductor layer over the adhesion layer, and applying a reacting layer over the electrical conductor layer. A laser beam is directed over the reacting layer in a desired pattern to interdiffuse the reacting and conductor layers and form a reaction product. The reaction product is used as an etch mask for etching away the reacting layer, the conductor layer, and the adhesion layer outside of the reaction product.

Abstract: A process for filling cavities in a flat surface on a substrate by metal deposition which includes depositing a film of metal onto the flat surface and cavities in a substantially perpendicular direction to the surface, and simultaneously re-sputtering and deposited film on the flat surface by ion beam milling at an angle to the surface of the substrate for achieving the deposition of metal into the cavities and filling the cavities without leaving any film on the flat surface.

Abstract: A method of making an electrical multilayer copper interconnect in which the electrical lines are protected by an electroplated overcoat. A plating interconnect is deposited on a substrate, a sacrificial layer of dielectric material is deposited on the plating interconnect. Thereafter a plating mask is formed on the dielectric material. Two self-aligned plating masks are patterned in one step, one of which is a plating mask for copper plating and the other is a plating mask for the overcoat. Preferably, before electroplating the overcoat, the copper is etched for exposing the sides adjacent the dielectric layer for allowing overcoating all of the copper.