Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a circuit board, at least one semiconductor chip mounted on the circuit board, a spacer disposed on the at least one semiconductor chip, the spacer having a thickness of about 5 ?m to about 110 ?m, and an upper surface of the spacer exposed externally; and an encapsulant covering the at least one semiconductor chip. The semiconductor package may have a small thickness and may prevent incomplete molding that causes exposure of an active surface of a semiconductor chip.

Abstract: An apparatus to fabricate a flip-chip package (FCP), and a method of fabricating an FCP using the same. The method includes providing a semiconductor chip such that an active surface on which a bump is formed faces upward, picking up the semiconductor chip using a pickup transfer and rotating the semiconductor chip such that the active surface of the semiconductor chip faces downward, directly transferring the semiconductor chip from the pickup transfer to a mount transfer, and mounting the semiconductor chip on a transfer unit using the mount transfer such that the active surface faces downward.

Abstract: A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusions from the contact pad and the ball pad are sized and arranged to have overlapping upper portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.

Abstract: A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusions from the contact pad and the ball pad are sized and arranged to have overlapping upper portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.

Abstract: A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusion from the contact pad and the ball pad are sized and arranged to have overlapping under portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.

Abstract: There are disclosed a stacked package formed by stacking semiconductor device packages and a manufacturing method thereof. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package body has the same thickness as that of the lead so as to expose the upper and the lower surfaces of the leads to the package body. Each of the packages is stacked on another package by electrically connecting the exposed upper and lower surfaces of the leads with each other. The manufacturing method has preparing lead frames, attaching an adhesive tape to the lower surface of the lead frame, bonding a semiconductor chip to the adhesive tape in the chip receiving cavity between the leads, connecting the semiconductor chip to the connection terminals, forming a package body, removing the adhesive tape; removing dam bars from the side frame, separating packages from the lead frame, and forming a stacked package by stacking a plurality of the packages.

Abstract: A stacked package formed by stacking semiconductor device packages and a method of manufacturing a stacked semiconductor package. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package body has the same thickness as that of the lead so as to expose the upper and the lower surfaces of the leads at a surface of the package body. Each of the packages is stacked on another package by electrically connecting the exposed surfaces of the leads. The manufacturing method includes preparing lead frames, including a plurality of leads, supporting a semiconductor chip in a chip receiving cavity between the leads, connecting the semiconductor chip to the connection terminals of the leads, forming a package body of a thickness such that a portion of surface of the leads are exposed, separating packages from the lead frame, and forming a stacked package by stacking a plurality of the packages.

Abstract: A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusion from the contact pad and the ball pad are sized and arranged to have overlapping under portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.