Patents by Inventor Ju Ko
Ju Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12015284Abstract: A method for measuring a position, is performed by a vehicle assembly (VA) for alignment between a ground assembly (GA) and the VA. The method includes transmitting low frequency (LF) signals to initiate alignment with the GA and estimating a position of a vehicle using at least one sensor mounted on the vehicle. Information regarding the estimated position of the vehicle is provided to the GA and information regarding a position of the vehicle measured by LF receive antennas of the GA and an acceleration flag calculated by the GA is received. Accordingly, a transmission strength of the LF signals transmitted by the VA is adjusted based on the information regarding the position of the vehicle measured by the LF receive antennas and the acceleration flag.Type: GrantFiled: December 21, 2022Date of Patent: June 18, 2024Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Autron Co., Ltd.Inventors: Jae Yong Seong, Chang Woo Ha, Ki Won Ko, Bong Ju Kim
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Publication number: 20240167163Abstract: An anti-diffusion substrate structure includes a substrate, a substrate circuit layer, and a chip. The substrate has multiple through holes. Within each of the through holes includes a first metal layer and an anti-diffusion layer plated on the first metal layer. The anti-diffusion layer is an Electroless Palladium Immersion Gold (EPIG) layer or an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) layer. The substrate circuit layer is mounted on the substrate and extended on the anti-diffusion layer within each of the through holes. The substrate circuit layer is made of a second metal layer, and a composition of the second metal layer is different from a composition of the first metal layer. The chip is electrically connected to the substrate circuit layer. The anti-diffusion layer is able to better prevent material of the first metal layer from migrating or diffusing to the second metal layer.Type: ApplicationFiled: December 23, 2022Publication date: May 23, 2024Inventors: YI LING CHEN, WEI TSE HO, CHIN-SHENG WANG, PU-JU LIN, CHENG-TA KO
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Publication number: 20240168307Abstract: Disclosed is a polarized light generating device based on an optical waveguide, which includes first to fourth input optical waveguides, respectively, for receiving input light from an outside, first to fifth optical splitters configured to receive at least one light and output the received at least one light as at least one light, and an optical converter configured to receive at least one light from the fifth optical splitter and convert the received light to generate polarized light. The polarized light generating device receives the input light through one of the first to fourth input optical waveguides, and generates a first polarized light, a second polarized light, a third polarized light, and a fourth polarized light. The first to fourth polarized lights belong to elements of two arbitrary two-dimensional mutually unbiased basis sets.Type: ApplicationFiled: November 21, 2023Publication date: May 23, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Kap Joong KIM, Chun Ju Youn, Young-Ho Ko, Minchul Kim, Seong Su Park, Kyongchun Lim, Byung-seok Choi, Joong-Seon Choe, Won Seok Han
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Patent number: 11991824Abstract: A circuit board structure includes a first sub-circuit board, a second sub-circuit board, and a third sub-circuit board. The first sub-circuit board has an upper surface and a lower surface opposite to each other, and includes at least one first conductive through hole. The second sub-circuit board is disposed on the upper surface of the first sub-circuit board and includes at least one second conductive through hole. The third sub-circuit board is disposed on the lower surface of the first sub-circuit board and includes at least one third conductive through hole. At least two of the first conductive through hole, the second conductive through hole, and the third conductive through hole are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first, second and third sub-circuit boards are electrically connected to one another.Type: GrantFiled: September 26, 2021Date of Patent: May 21, 2024Assignee: Unimicron Technology Corp.Inventors: Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Shao-Chien Lee, Ming-Ru Chen, Cheng-Chung Lo
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Publication number: 20240154447Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.Type: ApplicationFiled: August 29, 2023Publication date: May 9, 2024Applicant: PEGATRON CORPORATIONInventors: Yi-Hsuan Lee, Liang-Cheng Kuo, Chun-Wei Ko, Ya Ju Cheng, Chih Wei Huang, Ywh Woei Yeh, Yu Cheng Lin, Yen Ting Wang
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Publication number: 20240132330Abstract: Motor control architecture including a travel, a hoist, and a controller is disclosed. The travel disposed on a main rail having an auxiliary-encoder includes a master-driver and a slave-driver for driving two motors. Each motor has a main-encoder. The hoist drives a rope and calculates a rope length continuously. The controller calculates an anti-sway position command based on the rope-length and a position command. The two drivers perform a full closed-loop computation based on a feedback of one main-encoder, a feedback of the auxiliary-encoder, and the anti-sway position command. Wherein, the master-driver controls one motor based on a speed command generated by the full closed-loop computation and the slave-driver follows the speed command and a torque command of the master-driver to drive another motor; or the two drivers compensate the torque command based on an error value between the feedback of one main-encoder and the feedback of the auxiliary-encoder.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Inventors: Huan-Chang CHEN, Po-Jen KO, Chun-Ju WU, Lon-Jay CHENG, Wan-Ping CHEN, Chih-Yuan CHANG
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Publication number: 20240138063Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a plurality of pads, a first dielectric layer, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A plurality of first openings of the first dielectric layer expose part of the pads, and a first surface of the first dielectric layer is higher upper surfaces of the pads. The solder balls are disposed in a plurality of third openings of the third dielectric layer and are electrically connected to the second metal layer and the carrier. The surface treatment layer is disposed on the upper surfaces, and a top surface of the surface treatment layer is higher than the first surface.Type: ApplicationFiled: November 15, 2022Publication date: April 25, 2024Applicant: Unimicron Technology Corp.Inventors: Ping-Tsung Lin, Kai-Ming Yang, Chia-Yu Peng, Pu-Ju Lin, Cheng-Ta Ko
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Publication number: 20240138059Abstract: A circuit board structure includes a carrier, a thin film redistribution layer disposed on the carrier, solder balls electrically connected to the thin film redistribution layer and the carrier, and a surface treatment layer. The thin film redistribution layer includes a first dielectric layer, pads, a first metal layer, a second dielectric layer, a second metal layer, and a third dielectric layer. A top surface of the first dielectric layer is higher than an upper surface of each pad. The first metal layer is disposed on a first surface of the first dielectric layer. The second dielectric layer has second openings exposing part of the first metal layer. The second metal layer extends into the second openings and is electrically connected to the first metal layer. The third dielectric layer has third openings exposing part of the second metal layer. The surface treatment layer is disposed on the upper surfaces.Type: ApplicationFiled: November 23, 2022Publication date: April 25, 2024Applicant: Unimicron Technology Corp.Inventors: Kai-Ming Yang, Chia-Yu Peng, Cheng-Ta Ko, Pu-Ju Lin
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Publication number: 20240128179Abstract: A package structure includes a first substrate, a second substrate disposed on the first substrate, a third substrate disposed on the second substrate, and multiple chips mounted on the third substrate. A second coefficient of thermal expansion (CTE) of the second substrate is less than a first CTE of the first substrate. The third substrate includes a first sub-substrate, a second sub-substrate in the same level with the first sub-substrate, a third sub-substrate in the same level with the first sub-substrate. A CTE of the first sub-substrate, a CTE of the second sub-substrate, and a CTE of the third sub-substrate are less than the second CTE of the second substrate.Type: ApplicationFiled: November 8, 2022Publication date: April 18, 2024Inventors: Jyun-Hong CHEN, Chi-Hai KUO, Pu-Ju LIN, Cheng-Ta KO
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Publication number: 20240120343Abstract: A thin film transistor array substrate including a substrate including an active area and a non-active area, and a first thin film transistor disposed on the substrate while including a first oxide semiconductor pattern, a first gate electrode overlapping with the first oxide semiconductor pattern, a first gate insulating layer interposed between the first oxide semiconductor pattern and the first gate electrode, a first source electrode and a first drain electrode disposed on and connected to the first oxide semiconductor pattern, and a first light shielding pattern disposed under the first oxide semiconductor pattern and electrically connected to one of the first source electrode and the first drain electrodes. The first gate electrode includes a first portion maintaining a first parasitic capacitance and a second portion maintaining a second parasitic capacitance smaller than the first parasitic capacitance, together with the first oxide semiconductor pattern.Type: ApplicationFiled: August 8, 2023Publication date: April 11, 2024Applicant: LG Display Co., Ltd.Inventors: Hong Rak CHOI, Do Hyung LEE, Young Hyun KO, Chan Yong JEONG, Sung Ju CHOI
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Patent number: 11955587Abstract: A light emitting diode (LED) package structure includes a glass substrate, conductive through holes, active elements, an insulating layer, LEDs and pads. The glass substrate has an upper surface and a lower surface. The conductive through holes penetrate the glass substrate and connect the upper and the lower surfaces. The active elements are disposed on the upper surface of the glass substrate and electrically connected to the conductive through holes. The insulating layer is disposed on the upper surface and covers the active elements. The LEDs are disposed on the insulating layer and electrically connected to at least one of the active elements. The pads are disposed on the lower surface of the glass substrate and electrically connected to the conductive through holes. A source of at least one active elements is directly electrically connected to at least one of the corresponding pads through the corresponding conductive through hole.Type: GrantFiled: April 12, 2021Date of Patent: April 9, 2024Assignee: Unimicron Technology Corp.Inventors: Jeng-Ting Li, Chi-Hai Kuo, Cheng-Ta Ko, Pu-Ju Lin
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Publication number: 20240109397Abstract: A method for controlling an electric heater of a vehicular heating, ventilation, and air conditioning (HVAC) system includes turning on the electric heater; determining whether an ambient air temperature of a vehicle is higher than or equal to a threshold ambient air temperature, and a battery temperature is lower than or equal to a threshold battery temperature; determining whether battery efficiency is lower than or equal to threshold efficiency when the ambient air temperature of the vehicle is higher than or equal to the threshold ambient air temperature, and the battery temperature is lower than or equal to the threshold battery temperature; and turning off the electric heater when the battery efficiency is lower than or equal to the threshold efficiency, wherein the electric heater is configured to receive electric energy from the battery.Type: ApplicationFiled: March 30, 2023Publication date: April 4, 2024Inventors: Dae Hyun Song, Chang Gi Ryu, Woo Jin Lee, Dong Ju Ko, Hyun Hun Choi, Chun Kyu Kwon, In Uk Ko
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Patent number: 11943877Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.Type: GrantFiled: March 2, 2022Date of Patent: March 26, 2024Assignee: Unimicron Technology Corp.Inventors: Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko, Chin-Sheng Wang, Guang-Hwa Ma, Tzyy-Jang Tseng
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Patent number: 11932895Abstract: The present disclosure relates to a composition for preparing hexanol or butanol and a method for preparing hexanol or butanol using ethanol and synthesis gas, wherein the composition according to an aspect of the present disclosure is a medium composition containing ethanol as an active ingredient, and by culturing a strain producing hexanol or butanol after inoculating with a medium containing the composition and supplying synthesis gas, hexanol or butanol can be prepared economically using inexpensive synthesis gas, and hexanol or butanol can be prepared with high efficiency by focusing the flow of a carbon source consumed in a fermentation process to the production of hexanol or butanol.Type: GrantFiled: June 24, 2022Date of Patent: March 19, 2024Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Hyun Ju Oh, Youngsoon Um, Sun Mi Lee, Gyeongtaek Gong, Ja Kyong Ko
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Publication number: 20240085777Abstract: Provided is a process proximity effect correction method capable of efficiently improving the dispersion of patterns. There is a process proximity effect correction method according to some embodiments, the process proximity effect correction method of a process proximity effect correction device for performing process proximity effect correction (PPC) of a plurality of patterns using a machine learning module executed by a processor, comprising: training a sensitivity model by inputting a layout image of the plurality of patterns and a layout critical dimension (CD) of the plurality of patterns into the machine learning module; estimating an after cleaning inspection critical dimension (ACI-CD) sensitivity prediction value of the plurality of patterns by inferring an ACI-CD prediction value of the plurality of patterns; and determining a correction rate of the layout CD of the plurality of patterns using the estimated sensitivity prediction value.Type: ApplicationFiled: May 31, 2023Publication date: March 14, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Dae Young PARK, Jeong Hoon KO, Seong Ryeol KIM, Young-Gu KIM, Tae Hoon KIM, Hyun Joong KIM, Young Ju LEE
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Publication number: 20240087358Abstract: A processor-implemented method includes generating a preprocessed infrared (IR) image by performing first preprocessing based on an IR image including an object; generating a preprocessed depth image by performing second preprocessing based on a depth image including the object; and determining whether the object is a genuine object based on the preprocessed IR image and the preprocessed depth imageType: ApplicationFiled: November 21, 2023Publication date: March 14, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youngjun KWAK, Minsu KO, Youngsung KIM, Heewon KIM, Ju Hwan SONG, Byung In YOO, Seon Min RHEE, Yong-il LEE, Jiho CHOI, Seungju HAN
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Publication number: 20240086603Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.Type: ApplicationFiled: November 16, 2023Publication date: March 14, 2024Applicant: SAMSUNG ELECTRONICS CO, LTD.Inventors: In HUH, Jeong-hoon KO, Hyo-jin CHOI, Seung-ju KIM, Chang-wook JEONG, Joon-wan CHAI, Kwang-II PARK, Youn-sik PARK, Hyun-sun PARK, Young-min OH, Jun-haeng LEE, Tae-ho LEE
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Publication number: 20220304470Abstract: A functional chair is disclosed. The functional chair includes a first plate that accommodates a hip and a thigh when a user is seated on the functional chair, a second plate that accommodates a waist and a back when the user is seated on the functional chair, and a connecting portion that connects the first plate and the second plate. The second plate may have an acupressure portion that adheres to the waist when the user is seated on the functional chair.Type: ApplicationFiled: February 4, 2021Publication date: September 29, 2022Applicant: Baleun GNB Co., Ltd.Inventors: Jong Yeong HA, Ki Ju KO
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Patent number: 11300221Abstract: A valve apparatus for a vehicle includes a housing having open and closed ends to form an interior space, and formed with first and second intake ports receiving a transmission fluid from a transmission and an oil cooler, a bypass port bypassing the transmission fluid to the transmission, and an exhaust port exhausting the transmission fluid to the oil cooler, an inner cap inserted at least partially into the interior space, fixed to the housing, and having an open hole inserted into the interior space, an operation unit disposed between the inner cap and the closed end of the housing, and reciprocally moves according to a transmission fluid temperature, a valve unit disposed in the operation unit to selectively open and close the bypass port and the exhaust port depending on a movement of the operation unit; and an elastic member interposed between the inner cap and the operation unit.Type: GrantFiled: May 8, 2020Date of Patent: April 12, 2022Assignees: HYUNDAI MOTOR COMPANY, INZICONIROLS CO., LTD., KIA MOTORS CORPORATIONInventors: Jae Yeon Kim, Jun Ho Jang, Hyuk Ju Ko
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Patent number: 11214095Abstract: Provided are a sheet, a method of its preparation, and a tire comprising the sheet, wherein the sheet comprises tire cords, a topping rubber for topping the tire cords, and a conductive fiber located on the surface of the topping rubber. The sheet can provide tires, on which a rubber composition with a low electricity-transmitting property and low rolling resistance is applied, with excellent conductivity.Type: GrantFiled: November 27, 2018Date of Patent: January 4, 2022Inventors: Ji Wan Lee, Mi Jung Lee, Sung Tae Kim, Kil Ju Ko, Il Yong Park, Su Hong Sung