Patents by Inventor Ju Lyu

Ju Lyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11959012
    Abstract: The present disclosure a temperature-resistant and salt-resistant modified nano-graphite dispersed particle gel system with a strong self-growth effect.
    Type: Grant
    Filed: September 14, 2023
    Date of Patent: April 16, 2024
    Assignees: China University of Petroleum (East China), CNOOC Energy Development Co., Ltd. Engineering Branch, Tianjin Branch of China National Offshore Oil Corporation Ltd.
    Inventors: Guang Zhao, Caili Dai, Dongfang Lyu, Jiaming Li, Kequan Meng, Ju Zheng, Yanxu Zhang, Weiyu Chen, Liguo Zhu, Yanhui Zhang
  • Publication number: 20240110089
    Abstract: The present disclosure a temperature-resistant and salt-resistant modified nano-graphite dispersed particle gel system with a strong self-growth effect.
    Type: Application
    Filed: September 14, 2023
    Publication date: April 4, 2024
    Applicants: China University of Petroleum (East China), CNOOC Energy Development Co., Ltd. Engineering Branch, Tianjin Branch of China National Offshore Oil Corporation Ltd.
    Inventors: Guang ZHAO, Caili DAI, Dongfang LYU, Jiaming LI, Kequan MENG, Ju ZHENG, Yanxu ZHANG, Weiyu CHEN, Liguo ZHU, Yanhui ZHANG
  • Publication number: 20050003581
    Abstract: There are disclosed a stacked package formed by stacking semiconductor device packages and a manufacturing method thereof. Each package includes leads and connection terminals. A semiconductor chip is electrically connected to the connection terminals. A package body has the same thickness as that of the lead so as to expose the upper and the lower surfaces of the leads to the package body. Each of the packages is stacked on another package by electrically connecting the exposed upper and lower surfaces of the leads with each other. The manufacturing method has preparing lead frames, attaching an adhesive tape to the lower surface of the lead frame, bonding a semiconductor chip to the adhesive tape in the chip receiving cavity between the leads, connecting the semiconductor chip to the connection terminals, forming a package body, removing the adhesive tape; removing dam bars from the side frame, separating packages from the lead frame, and forming a stacked package by stacking a plurality of the packages.
    Type: Application
    Filed: July 29, 2004
    Publication date: January 6, 2005
    Inventors: Ju Lyu, Kwan Lee, Tae Cho