Patents by Inventor Ju-Ming Huang

Ju-Ming Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
    Patent number: 11643544
    Abstract: A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: May 9, 2023
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Chih-Wei Liao, Ju-Ming Huang, Guan-Syun Tseng
  • Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same
    Patent number: 11414532
    Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: August 16, 2022
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Chih-Wei Liao, Guan-Syun Tseng, Tsung-Hsien Lin, Ju-Ming Huang
  • Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
    Patent number: 11339258
    Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, l, R1, and R2 are as defined in the specification.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: May 24, 2022
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Chih-Wei Liao, Guan-Syun Tseng, Tsung-Hsien Lin, Ju-Ming Huang, Chen-Hua Yu
  • Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
    Patent number: 11001759
    Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: May 11, 2021
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Chih-Wei Liao, Chang-Chien Yang, Tsung-Hsien Lin, Ju-Ming Huang
  • Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
    Patent number: 10994516
    Abstract: A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: May 4, 2021
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Chih-Wei Liao, Hsien-Te Chen, Tsung-Hsien Lin, Ju-Ming Huang
  • Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same
    Patent number: 10920008
    Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: February 16, 2021
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Ju-Ming Huang, Chen-Hua Yu, Chang-Chien Yang, Guan-Syun Tseng, Chih-Wei Liao
  • THERMAL-CURABLE RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME
    Publication number: 20200123307
    Abstract: A thermal-curable resin composition is provided. The thermal-curable resin composition comprises: (A) a thermal-curable resin component, which comprises: (a1) bismaleimide resin; (a2) cyanate ester resin; and (a3) epoxy resin, wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and (B) a filler, wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; and wherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.
    Type: Application
    Filed: January 17, 2019
    Publication date: April 23, 2020
    Inventors: JU-MING HUANG, CHEN-HUA YU, CHANG-CHIEN YANG, GUAN-SYUN TSENG, CHIH-WEI LIAO
  • Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
    Patent number: 10563006
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 18, 2020
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Guan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao
  • RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD USING THE SAME
    Publication number: 20190382556
    Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) epoxy resin; (B) a compound of formula (I), in formula (I), R1 and R2 are independently —H, —CH3, or —C(CH3); and (C) an optional filler.
    Type: Application
    Filed: September 6, 2018
    Publication date: December 19, 2019
    Inventors: CHIH-WEI LIAO, GUAN-SYUN TSENG, TSUNG-HSIEN LIN, JU-MING HUANG
  • RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
    Publication number: 20190241733
    Abstract: A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).
    Type: Application
    Filed: September 17, 2018
    Publication date: August 8, 2019
    Inventors: Chih-Wei LIAO, Ju-Ming HUANG, Guan-Syun TSENG
  • RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
    Publication number: 20190203123
    Abstract: A resin composition is provided. The resin composition comprises the following constituents: (A) an epoxy resin, which has at least two epoxy functional groups per molecule; (B) a reactive flame retardant with (a DOPO functional group) in structure; and (C) a non-reactive phosphorus-containing flame retardant, which is compatible with the other constituents of the resin composition.
    Type: Application
    Filed: June 15, 2018
    Publication date: July 4, 2019
    Inventors: CHIH-WEI LIAO, CHANG-CHIEN YANG, TSUNG-HSIEN LIN, JU-MING HUANG
  • RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
    Publication number: 20190203003
    Abstract: A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, 1, R1, and R2 are as defined in the specification.
    Type: Application
    Filed: June 15, 2018
    Publication date: July 4, 2019
    Inventors: CHIH-WEI LIAO, GUAN-SYUN TSENG, TSUNG-HSIEN LIN, JU-MING HUANG, CHEN-HUA YU
  • RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME
    Publication number: 20190071548
    Abstract: A resin composition is provided. The resin composition comprises the following components: (A) epoxy resin; (B) a cross-linking agent; (C) bismaleimide resin (BMI) represented by the following formula (I): wherein R1 is an organic group; and (D) a resin represented by the following formula (II): wherein n is an integer of 1 to 10.
    Type: Application
    Filed: January 2, 2018
    Publication date: March 7, 2019
    Inventors: CHIH-WEI LIAO, Hsien-TE CHEN, TSUNG-HSIEN LIN, JU-MING HUANG
  • Resin Composition, Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same
    Publication number: 20180312627
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin with at least two epoxy groups in each molecule, and a first hardener of the following formula (I): wherein R11, R12, R13, R14, R15, R16, and n are as defined in the specification.
    Type: Application
    Filed: August 2, 2017
    Publication date: November 1, 2018
    Inventors: Chih-Wei LIAO, Guan-Syun TZENG, Ju-Ming HUANG, Chang-Chien YANG
  • Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Prepared Using the Same
    Publication number: 20180044467
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
    Type: Application
    Filed: July 31, 2017
    Publication date: February 15, 2018
    Inventors: Guan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao