Abstract: A method, apparatus and program storage device for analyzing and optimizing equipment efficiency are disclosed. In an illustrative embodiment equipment running time is subdivided into a valuable operating time component and a plurality of performance loss time components. Ideal equipment reference information reflecting dynamic manufacturing parameters is simulated, and an operational performance loss is analyzed in detail. From the analysis of the operational performance loss, priority in input of resources is determined. Advantageously, parameters of a dynamically changing manufacturing environment are incorporated in the analysis and optimization of general equipment efficiency. Moreover, performance loss is more accurately analyzed compared to conventional methods. As such, the performance operating rate is more effectively utilized in reducing performance loss.

Abstract: An apparatus for testing semiconductor devices allows various testing processes, including a burn-in process, to be performed at the same testing stage. Test trays which contain the semiconductor devices are used throughout an in-line system so that an entire back-end process can be performed without loading/unloading the semiconductor devices between the various tests. The in-line system includes multiple test and burn-in apparatuses as well as a single sorting unit which performs a composite sorting operation after all the testing processes. A method for testing semiconductor devices in the in-line system includes testing the semiconductor devices in the test trays using the test and burn-in apparatus, transferring the test trays to a different testing apparatus for a second testing, and finally sorting the semiconductor devices after all testing processes have been performed based on a final sorting map created by combining test tray maps generated during each of the tests.

Abstract: A test and burn-in apparatus for semiconductor chip package devices, an in-line system which includes the test and burn-in apparatus, and a test method which employs the in-line system are provided. A test and burn-in apparatus for testing semiconductor devices allows various testing processes, including a burn-in process, to be performed at the same testing stage. The apparatus employs test trays which contain the semiconductor devices. These test trays are used throughout the in-line system so that an entire back-end process can be performed without the need for loading/unloading the semiconductor devices into and from device trays between the various tests. The test and burn-in apparatus according to this invention can therefore occupy less space than the prior art testing apparatuses. The in-line system includes multiple test and burn-in apparatuses as well as a single sorting unit which performs a composite sorting operation after all the testing processes have been performed.

Abstract: A chip scale package (CSP) fabricating method is provided. In this method, CSP chips are fabricated on a wafer and subjected to an electric die sorting (EDS) process. Then, CSP chips determined to be non-defective through the FDS process are packaged into a CSP strip. and the CSP strip is subjected to a final test. Then, the CSP strip subjected to the final test is singulated into individual CSPs. Following this, the CSPs are surface-mounted on a module board. Substantially all of the CSPs on the CSP module board are subsequently burn-in tested. As a result, productivity is improved, and manufacturing costs are reduced.

Abstract: A method, apparatus and program storage device for analyzing and optimizing equipment efficiency are disclosed. In an illustrative embodiment equipment running time is subdivided into a valuable operating time component and a plurality of performance loss time components. Ideal equipment reference information reflecting dynamic manufacturing parameters is simulated, and an operational performance loss is analyzed in detail. From the analysis of the operational performance loss, priority in input of resources is determined. Advantageously, parameters of a dynamically changing manufacturing environment are incorporated in the analysis and optimization of general equipment efficiency. Moreover, performance loss is more accurately analyzed compared to conventional methods. As such, the performance operating rate is more effectively utilized in reducing performance loss.