Abstract: An operating method of a semiconductor memory device may include receiving a command, outputting a status signal as a busy status while accessing a selected area of the memory cell array in response to the command, changing the status signal from the busy status to a ready status and outputting the status signal after the access is completed, and applying a dummy pulse to an unselected area of the memory cell array in response to the status signal being output as the ready status.

Abstract: A method of programming a nonvolatile memory device comprises performing a first program operation on first memory cells and second memory cells so that threshold voltages of the first and second memory cells have a first reference level lower than a first target level, the first memory cells having the first target level as a first target level, and the second memory cells having a second target level higher than the first target level as a second target level; performing a second program operation on the second memory cells so that the threshold voltages of the second memory cells have a second reference level lower than the second target level; and performing a third program operation on the first and second memory cells to have the respective target levels.

Abstract: A nonvolatile memory device including a bit line voltage supply unit configured to supply a power source voltage, a second voltage in which a second reference voltage has been subtracted from a third reference voltage, or a third voltage in which a first reference voltage has been subtracted from the third reference voltage according to data stored in a first latch unit, a second latch unit, and a third latch unit included in a page buffer, and a bit line voltage setting unit configured to transfer a voltage of 0 V or an output voltage of the bit line voltage supply unit to a bit line according to the data stored in the first, second, and third latch units.

Abstract: A nonvolatile memory device includes a cell string, including a drain select transistor coupled to a bit line, a source select transistor coupled to a common source line, and memory cells coupled in series between the drain select transistor and the source select transistor, a latch unit, including a first latch for storing a detection result of a threshold voltage of a second memory cell adjacent to a first memory cell selected from among the memory cells and a second latch for storing a detection result of a threshold voltage of the first memory cell, and a first reset unit electrically coupled between the first and second latches and configured to reset the second latch, during a time in which a read operation is performed on the first memory cell, in response to a first reset signal and the detection result stored in the first latch.

Abstract: A nonvolatile memory device includes a cell string, including a drain select transistor coupled to a bit line, a source select transistor coupled to a common source line, and memory cells coupled in series between the drain select transistor and the source select transistor, a latch unit, including a first latch for storing a detection result of a threshold voltage of a second memory cell adjacent to a first memory cell selected from among the memory cells and a second latch for storing a detection result of a threshold voltage of the first memory cell, and a first reset unit electrically coupled between the first and second latches and configured to reset the second latch, during a time in which a read operation is performed on the first memory cell, in response to a first reset signal and the detection result stored in the first latch.

Abstract: A NAND flash memory device is recovered by applying a predetermined bias to a drain or a source. A negative bias is applied to a cell gate so that electrons are injected into a floating gate of a cell. This narrows the distribution of an erase threshold voltage and minimizes interference from states of peripheral cells.

Abstract: A method of programming a nonvolatile memory device comprises performing a first program operation on first memory cells and second memory cells so that threshold voltages of the first and second memory cells have a first reference level lower than a first target level, the first memory cells having the first target level as a first target level, and the second memory cells having a second target level higher than the first target level as a second target level; performing a second program operation on the second memory cells so that the threshold voltages of the second memory cells have a second reference level lower than the second target level; and performing a third program operation on the first and second memory cells to have the respective target levels.

Abstract: A flash memory device includes a plurality of memory cell blocks, a control unit, a program speed calculation unit, a voltage generator and a block select unit. Each memory cell block includes a string having a drain select transistor, a plurality of memory cells, a novel cell and a source select transistor. The control unit generates a block select signal in response to an address signal and generates an operation control signal in response to a command signal. The program speed calculation unit decides a level of an initial program voltage based on threshold voltages detected after a program operation of the novel cells. The voltage generator generates operating voltages including the initial program voltage of the level according to the operation control signal. The block select unit transfers the operating voltages to a memory cell block corresponding to the block select signal.

Abstract: A flash memory device may include a memory cell array, a page buffer unit, and a switching element. The page buffer unit may include first and second latches and is configured to program data into the memory cell array and read data from the memory cell array. The switching element enables the first latch during a verify operation of a first program based on a first verify voltage, and enables or disables the first latch in order to execute a verify operation of a second program based on a second verify voltage lower than the first verify voltage depending on whether data to be programmed has been stored in the second latch.

Abstract: In a driving method of a flash memory device including a selected first bit line and an unselected second bit line, a program voltage of a pulse is applied to word lines of all memory cells in a block passing an erase verify operation. After the first and second bit lines are precharged to a predetermined level, a ground voltage is applied to the word lines of all the memory cells in the block. The memory cells are evaluated for a predetermined time shorter than an evaluation time of a read operation. Whether or not a memory cell passing a verify operation exists among the memory cells is sensed. Resultantly, when the memory cell passing the verify operation exists, the memory cells in the block are programmed to a desired level using a predetermined program voltage and a step voltage.

Abstract: A nonvolatile memory device including a bit line voltage supply unit configured to supply a power source voltage, a second voltage in which a second reference voltage has been subtracted from a third reference voltage, or a third voltage in which a first reference voltage has been subtracted from the third reference voltage according to data stored in a first latch unit, a second latch unit, and a third latch unit included in a page buffer, and a bit line voltage setting unit configured to transfer a voltage of 0 V or an output voltage of the bit line voltage supply unit to a bit line according to the data stored in the first, second, and third latch units.

Abstract: Provided is a method of reading a flash memory device for depressing read disturb. According to the method, a first voltage is applied to a gate of the drain select transistor to turn on the drain select transistor, and a read voltage is applied to a gate of a selected transistor among the plurality of memory cells. Then, a pass voltage is applied to gates of unselected transistors among the plurality of memory cells. Furthermore, when the pass voltage is applied, a first pass voltage is applied and then a second pass voltage is applied after an elapse of a predetermined time following the applying of the first pass voltage. The second pass voltage has a level different from that of the first pass voltage.

Abstract: In an erase verifying method of a NAND flash memory device, a power supply voltage (Vcc) is applied to a second bit line while precharging a first bit line to a first positive voltage. Select transistors are turned on, and a ground voltage is applied to word lines of memory cell transistors. A second positive voltage is applied to source lines to which sources of the select transistors and the memory cell transistors are connected. An erased state of the memory cell transistor is verified according to whether charges accumulated in the first bit line are discharged.

Abstract: A duel program verify operation is performed using first and second verify voltages. In order to reduce the width of a threshold voltage distribution during an incremental step pulse program implementation, data of a corresponding memory cell are verified twice using the first verify voltage and the second verify voltage. During a second verify operation using the second verify voltage, a sensing current is adjusted by controlling voltages applied as a bit line select signal and an evaluation time period. Therefore, the threshold voltage of the memory cell can be measured higher or lower than its actual value and the width of a threshold voltage distribution is reduced.

Abstract: A flash memory device includes a plurality of memory cell blocks, a control unit, a program speed calculation unit, a voltage generator and a block select unit. Each memory cell block includes a string having a drain select transistor, a plurality of memory cells, a novel cell and a source select transistor. The control unit generates a block select signal in response to an address signal and generates an operation control signal in response to a command signal. The program speed calculation unit decides a level of an initial program voltage based on threshold voltages detected after a program operation of the novel cells. The voltage generator generates operating voltages including the initial program voltage of the level according to the operation control signal. The block select unit transfers the operating voltages to a memory cell block corresponding to the block select signal.

Abstract: A flash memory device may include a memory cell array, a page buffer unit, and a switching element. The page buffer unit may include first and second latches and is configured to program data into the memory cell array and read data from the memory cell array. The switching element enables the first latch during a verify operation of a first program based on a first verify voltage, and enables or disables the first latch in order to execute a verify operation of a second program based on a second verify voltage lower than the first verify voltage depending on whether data to be programmed has been stored in the second latch.

Abstract: In a driving method of a flash memory device including a selected first bit line and an unselected second bit line, a program voltage of a pulse is applied to word lines of all memory cells in a block passing an erase verify operation. After the first and second bit lines are precharged to a predetermined level, a ground voltage is applied to the word lines of all the memory cells in the block. The memory cells are evaluated for a predetermined time shorter than an evaluation time of a read operation. Whether or not a memory cell passing a verify operation exists among the memory cells is sensed. Resultantly, when the memory cell passing the verify operation exists, the memory cells in the block are programmed to a desired level using a predetermined program voltage and a step voltage.

Abstract: Provided is a method of reading a flash memory device for depressing read disturb. According to the method, a first voltage is applied to a gate of the drain select transistor to turn on the drain select transistor, and a read voltage is applied to a gate of a selected transistor among the plurality of memory cells. Then, a pass voltage is applied to gates of unselected transistors among the plurality of memory cells. Furthermore, when the pass voltage is applied, a first pass voltage is applied and then a second pass voltage is applied after an elapse of a predetermined time following the applying of the first pass voltage. The second pass voltage has a level different from that of the first pass voltage.

Abstract: A duel program verify operation is performed using first and second verify voltages. In order to reduce the width of a threshold voltage distribution during an incremental step pulse program implementation, data of a corresponding memory cell are verified twice using the first verify voltage and the second verify voltage. During a second verify operation using the second verify voltage, a sensing current is adjusted by controlling voltages applied as a bit line select signal and an evaluation time period. Therefore, the threshold voltage of the memory cell can be measured higher or lower than its actual value and the width of a threshold voltage distribution is reduced.

Abstract: In an erase verifying method of a NAND flash memory device, a power supply voltage (Vcc) is applied to a second bit line while precharging a first bit line to a first positive voltage. Select transistors are turned on, and a ground voltage is applied to word lines of memory cell transistors. A second positive voltage is applied to source lines to which sources of the select transistors and the memory cell transistors are connected. An erased state of the memory cell transistor is verified according to whether charges accumulated in the first bit line are discharged.