Abstract: A zoom optical system according to an embodiment of the present invention comprises a first lens group, a second lens group, a third lens group, and a fourth lens group which are sequentially arranged in a direction from a subject side to an image side, wherein each of the first lens group to the fourth lens group includes at least two lenses, the second lens group and the third lens group are movable, and an effective focal length (EFL) in a wide angle mode is defined by an expression below. 5.5 < EFL wide H image ? D < 6.5 . Here, EFLwide is the EFL of the zoom optical system in the wide angle mode, and HimageD is a half value of a diagonal length of a pixel area of an image sensor.

Abstract: A zoom optical system according to an embodiment of the present invention comprises a first lens group, a second lens group, a third lens group, and a fourth lens group which are successively arranged from an object side to an image side, wherein the first lens group to the fourth lens group each comprise two lenses, wherein the second lens group and the third lens group are movable, and wherein the telephoto effective focal length (EFL) is defined by the mathematical expression below: 9 . 0 < EFL tele H imageD < 9 . 5 where, EFLtele refers to the effective focal length of the zoom optical system in the telephoto, and HimageD refers to a value of half a diagonal length of an image sensor pixel area.

Abstract: A zoom optical system according to an embodiment of the present invention includes a first lens group, a second lens group, a third lens group, and a fourth lens group which are sequentially arranged in a direction from a subject side to an image side, wherein the second lens group and the third lens group are movable, and an effective focal length (EFL) in a telephoto mode is defined by an expression below. 11.5 < EFL tele H imageD < 12.5 Here, EFLtele is the EFL of the zoom optical system in the telephoto mode, and tele HimageD is a half value of a diagonal length of a pixel area of an image sensor.

Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

Abstract: A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.