Abstract: A method performed by an audio source device. The method obtains an input audio signal and determines a sound output level of a headset based on the input audio signal, a user volume setting, and a sound output sensitivity of the headset. The method determines whether the sound output level is above a threshold. In response to determining that the sound output level is above the threshold, a scalar gain is applied upon the input audio signal to produce an output audio signal for output by the headset.

Abstract: A method performed by an audio source device. The method obtains an input audio signal and determines a sound output level of a headset based on the input audio signal, a user volume setting, and a sound output sensitivity of the headset. The method determines whether the sound output level is above a threshold. In response to determining that the sound output level is above the threshold, a scalar gain is applied upon the input audio signal to produce an output audio signal for output by the headset.

Abstract: An apparatus and method to test components in a semiconductor test structure. On a semiconductor wafer, a test module implemented in one or more scribe lines between a plurality of semiconductor dies is used to test components in the semiconductor test structure. The test module may, for example, test electrical characteristics of chains of vias, transistors, and functional devices, such as oscillators. The test module contains a scan chain control coupled through a plurality of pass gates to each component to be tested. The scan chain control sequentially closes the pass gates to separately test the components in the semiconductor test structure. The test module further interfaces with an external testing device and the results of each test are compared with the expected results to identify faulty components.

Abstract: An apparatus and method to test components in a semiconductor test structure. On a semiconductor wafer, a test module implemented in one or more scribe lines between a plurality of semiconductor dies is used to test components in the semiconductor test structure. The test module may, for example, test electrical characteristics of chains of vias, transistors, and functional devices, such as oscillators. The test module contains a scan chain control coupled through a plurality of pass gates to each component to be tested. The scan chain control sequentially closes the pass gates to separately test the components in the semiconductor test structure. The test module further interfaces with an external testing device and the results of each test are compared with the expected results to identify faulty components.

Abstract: An apparatus and method to test components in a semiconductor test structure. On a semiconductor wafer, a test module implemented in one or more scribe lines between a plurality of semiconductor dies is used to test components in the semiconductor test structure. The test module may, for example, test electrical characteristics of chains of vias, transistors, and functional devices, such as oscillators. The test module contains a scan chain control coupled through a plurality of pass gates to each component to be tested. The scan chain control sequentially closes the pass gates to separately test the components in the semiconductor test structure. The test module further interfaces with an external testing device and the results of each test are compared with the expected results to identify faulty components.

Abstract: An apparatus and method to test components in a semiconductor test structure. On a semiconductor wafer, a test module implemented in one or more scribe lines between a plurality of semiconductor dies is used to test components in the semiconductor test structure. The test module may, for example, test electrical characteristics of chains of vias, transistors, and functional devices, such as oscillators. The test module contains a scan chain control coupled through a plurality of pass gates to each component to be tested. The scan chain control sequentially closes the pass gates to separately test the components in the semiconductor test structure. The test module further interfaces with an external testing device and the results of each test are compared with the expected results to identify faulty components.

Abstract: A rupturable cover (10) for an air bag module (22) comprises an inner cover (30) and an outer cover (80) overlying the inner cover. The inner cover (30) has a first tear seam (70) for enabling rupturing of the inner cover in response to inflation of an air bag (24). The outer cover (80) has a second tear seam (100) for enabling rupturing of the outer cover. The second tear seam (100) has a configuration different from the first tear seam (70). At least a portion of the second tear seam (100) overlies the first tear seam (70) when the outer cover (80) is adhered to the inner cover (30) in any one of a plurality of different positions of alignment. The second tear seam (100) may have a wavy configuration.

Abstract: A rupturable cover (10) for an air bag module (22) comprises an inner cover (30) and an outer cover (80) overlying the inner cover. The inner cover (30) has a first tear seam (70) for enabling rupturing of the inner cover in response to inflation of an air bag (24). The outer cover (80) has a second tear seam (100) for enabling rupturing of the outer cover. The second tear seam (100) has a configuration different from the first tear seam (70). At least a portion of the second tear seam (100) overlies the first tear seam (70) when the outer cover (80) is adhered to the inner cover (30) in any one of a plurality of different positions of alignment. The second tear seam (100) may have a wavy configuration.

Abstract: This describes a method for producing cement clinker using petroleum coke with a sulfur content over 4.5% by weight, in conventional equipment and facilities, wherein said method comprises the treatment of the raw mixture to synergistically improve its physical-chemical characteristics combined with the parameter control of the process, in such a way as to obtain a reduction of the clinkering temperature, all as a heretofore-unappreciated way to reduce, as a result, the concentration of SO3 in the calcinated material fed to the rotating kiln, and also usefully increasing with this the calcium sulfate content in the clinker.

Abstract: This describes a method for producing cement clinker using petroleum coke with a sulfur content over 4.5% by weight, in conventional equipment and facilities, wherein said method comprises the treatment of the raw mixture to synergistically improve its physical-chemical characteristics combined with the parameter control of the process, in such a way as to obtain a reduction of the clinkering temperature, all as a heretofore-unappreciated way to reduce, as a result, the concentration of SO3 in the calcinated material fed to the rotating kiln, and also usefully increasing with this the calcium sulfate content in the clinker.