Abstract: A method for controlling an electrical transmission network including a plurality of DC high-voltage lines and at least three AC/DC converters identified by a respective index i. For each of the converters having index i, the method includes recovering the setpoint active power value Pdci applied thereto, and recovering instantaneous voltage value Vi and voltage angle value ?i of the buses having index i and modifying the setpoint active power Pdci of each of the converters having index i by a value including a term ?Pdcsi as a function of a sum of deviations of voltage angles multiplied by contribution adjustment parameters.

Abstract: A method for controlling an electrical transmission network including a plurality of DC high-voltage lines and at least three AC/DC converters which are identified by a respective index i and are interconnected by the DC high-voltage lines. Each of the AC/DC converts are connected to an AC voltage bus identified by a respective index i as well as to one of the DC high-voltage lines.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by,decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.

Abstract: A well water level sensing apparatus using a pressurized air column in contact with the water at its distal end to derive a correlated value dependent upon the length of the air column which is converted for retrieving stored water levels from memory and displaying the retrieved water levels on a visual display. The water level sensing apparatus may be manually initiated or programmatically controlled for continual monitoring.

Abstract: A well water level sensing apparatus using a pressurized air column in contact with the water at its distal end to derive a correlated value dependent upon the length of the air column which is converted for retrieving stored water levels from memory and displaying the retrieved water levels on a visual display. The water level sensing apparatus may be manually initiated or programmatically controlled for continual monitoring.

Abstract: A method of micromachining a copper layer on a substrate is carried out by maintaining the substrate in a vacuum, bombarding a portion of the substrate with a focused particle beam from a particle source, and exposing the substrate to a supply of organic chloride or hydroxide during particle bombardment. The organic chloride or hydroxide concentration at the substrate is an amount sufficient to enhance the relative removal of the copper layer by decreasing the removal of the dielectric or increasing the removal of the copper or a combination of both.