Abstract: An electronic package, comprising a circuit carrying substrate (30) and a semiconductor device (35). The substrate (30) has two opposing surfaces, the first or bottom surface having a plurality of solder pads (31) and the second or top surface having a circuitry pattern defined on it. A semiconductor device (35) is attached to the top surface of the circuit carrying substrate (30). A molded body (33) is formed completely around the semiconductor device (35) in order to encapsulate it, the molded body also substantially covering the top surface of the circuit carrying substrate (30). A layer of metal deposited directly on the molded body and the top surface of the circuit carrying substrate is delineated into another conductive circuitry pattern (38), with part of the pattern (36) connected to the circuitry pattern on the circuit carrying substrate. An electronic component (32) is mounted on the molded body (33) and electrically connected to the conductive circuitry pattern (38).

Abstract: A pivotable spring probe (30) includes a housing (36) having an opening, a plunger (34) within and guided by the housing, the plunger being slidingly movable between an extended position and a retracted position, a pivotable contact head (32) mounted on the plunger for making electrical contact with a conductive surface external to the housing, and a spring (42) mounted on the bottom of the plunger for biasing the plunger towards the housing opening.