Patents by Inventor Judson V. Arnold

Judson V. Arnold has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High heat density transfer device
    Patent number: 5825624
    Abstract: Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.
    Type: Grant
    Filed: February 5, 1997
    Date of Patent: October 20, 1998
    Assignee: Lockhead Fort Worth Company
    Inventors: Judson V. Arnold, James R. Peoples, Elbert L. McKague
  • Process for manufacturing a high heat density transfer device
    Patent number: 5766691
    Abstract: Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.
    Type: Grant
    Filed: August 27, 1996
    Date of Patent: June 16, 1998
    Assignee: Lockheed Fort Worth Company
    Inventors: Judson V. Arnold, James R. Peoples, Elbert L. McKague
  • High heat density transfer device
    Patent number: 5566752
    Abstract: Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.
    Type: Grant
    Filed: October 20, 1994
    Date of Patent: October 22, 1996
    Assignee: Lockheed Fort Worth Company
    Inventors: Judson V. Arnold, James R. Peoples, Elbert L. McKague