Patents by Inventor Judy Galloway

Judy Galloway has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for cleaning integrated circuit bonding pads
    Patent number: 6355576
    Abstract: A method for cleaning bonding pads on a semiconductor device, as disclosed herein, includes treating the bonding pads with a CF4 and water vapor combination. In the process, the water vapor breaks up and the hydrogen from the water vapor couples to fluorine residue on the bonding pad surface creating a volatile HF vapor. In addition, fluorine from the CF4 exchanges with the titanium in the metallic polymer residue making the polymer more soluble for the organic strip operation which follows. Next, the resist is ashed and then an organic resist stripper is applied to the bonding pad area, thereby creating a clean bonding pad surface. Thereafter, a reliable bond wire connection can be made to the bonding pad.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: March 12, 2002
    Assignee: VLSI Technology Inc.
    Inventors: Mark Haley, Delbert Parks, Judy Galloway
  • Method and apparatus for cleaning integrated circuit bonding pads
    Publication number: 20020028586
    Abstract: A method for cleaning bonding pads on a semiconductor device, as disclosed herein, includes treating the bonding pads with a CF4 and water vapor combination. In the process, the water vapor breaks up and the hydrogen from the water vapor couples to fluorine residue on the bonding pad surface creating a volatile HF vapor. In addition, fluorine from the CF4 exchanges with the titanium in the metallic polymer residue making the polymer more soluble for the organic strip operation which follows. Next, the resist is ashed and then an organic resist stripper is applied to the bonding pad area, thereby creating a clean bonding pad surface. Thereafter, a reliable bond wire connection can be made to the bonding pad.
    Type: Application
    Filed: September 21, 2001
    Publication date: March 7, 2002
    Inventors: Mark Haley, Delbert Parks, Judy Galloway