Abstract: A waterproof lockable door and a pressure adjusted plug thereof are provided. An electronic device is formed with an opening having an annular wall. The waterproof lockable door includes a cover member having at least one through hole and a pressure adjusted plug including a waterproof member and at least one fastening unit. The waterproof member includes at least one fastening hole. The fastening unit is formed with a head portion and a rod portion, and the rod portion is received in the through hole and moves relative to the cover member, thereby driving the outer periphery of the waterproof member to be tightly adjacent to annular wall. Accordingly, the tolerance of the annular wall and the waterproof member and the air pressure inside an opening both force the waterproof member to move.

Abstract: A snap-on battery includes a battery body and a fastening element, and the battery body has a guiding element disposed on a side of the battery body, and the fastening element is slidably coupled to and positioned at the guiding element, and the fastening element has a combining portion for combining an external connecting element. With the aforementioned components, the battery can be detachably snapped on a portable electronic device, and even if a user forgets to close a door with cover or secure the door with cover, the battery will be still hard to slip off the portable electronic device or damages due to falling out.

Abstract: A waterproof door assembly of an electronic device having an opening with an annulus wall includes a fastening element formed on the electronic device, a waterproof door having a door panel pivotally coupled to the electronic device and a replaceable ring, and a switch flipping element. A bump and an engaging portion are extended from opposite sides of the door panel respectively. The replaceable ring is sheathed on the periphery of the bump; the switch flipping element slides on the door panel. The switch flipping element has a snapping portion and a fastening portion for performing a multi-stage position adjustment to latch the fastening portion to the corresponding fastening element. The bump is inserted into the opening, and the replaceable ring is clamped between the annulus wall and the bump to maintain high sealing performance and long service life of the waterproof door.

Abstract: A manufacturing method of a glass fiber product is disclosed. A glass fiber resin is provided. The glass fiber resin includes a thermoplastic resin, a glass fiber, and an additive. The amount of the thermoplastic resin is between 30 wt % and 70 wt %, the content of the glass fiber is between 40 wt % and 70 wt % and the amount of the additive is between 0.1 wt % and 15 wt %. A molding process is performed for the glass fiber resin to mold the glass fiber resin into a semi-finished product. A mechanical machining process is performed on the semi-finished product to form at least one recessed structure in the semi-finished product, so as to form a final product.

Abstract: A waterproof lockable door and an automatic pressure adjusting plug set thereof are provided. An electronic device is formed with an opening having an annular wall. The waterproof lockable door includes a cover member formed with at least a penetrated hole and an automatic pressure adjusting plug set including a waterproof member and at least a fastening unit. The waterproof member is formed with at least a fasten hole. The fastening unit is formed with a head portion and a rod portion, and the rod portion is received in the penetrated hole and generates a movement relative to the cover member thereby driving the outer periphery of the waterproof member to be tightly adjacent to annular wall. Accordingly, the tolerance of the annular wall and the waterproof member and the air pressure inside an opening both force the waterproof member to move.

Abstract: A waterproof door assembly of an electronic device having an opening with an annulus wall includes a fastening element formed on the electronic device, a waterproof door having a door panel pivotally coupled to the electronic device and a replaceable ring, and a switch flipping element. A bump and an engaging portion are extended from opposite sides of the door panel respectively. The replaceable ring is sheathed on the periphery of the bump; the switch flipping element slides on the door panel. The switch flipping element has a snapping portion and a fastening portion for performing a multi-stage position adjustment to latch the fastening portion to the corresponding fastening element. The bump is inserted into the opening, and the replaceable ring is clamped between the annulus wall and the bump to maintain high sealing performance and long service life of the waterproof door.

Abstract: A snap-on battery includes a battery body and a fastening element, and the battery body has a guiding element disposed on a side of the battery body, and the fastening element is slidably coupled to and positioned at the guiding element, and the fastening element has a combining portion for combining an external connecting element.

Abstract: A manufacturing method of a glass fiber product is disclosed. A glass fiber resin is provided. The glass fiber resin includes a thermoplastic resin, a glass fiber, and an additive. The amount of the thermoplastic resin is between 30 wt % and 70 wt %, the content of the glass fiber is between 40 wt % and 70 wt % and the amount of the additive is between 0.1 wt % and 15 wt %. A molding process is performed for the glass fiber resin to mold the glass fiber resin into a semi-finished product. A mechanical machining process is performed on the semi-finished product to form at least one recessed structure in the semi-finished product, so as to form a final product.

Abstract: A heat dissipation module includes an airflow generation device that generates airflow into an air channel in which a fin module is received and fixed. The fin module includes a plurality of fin plates substantially parallel to and spaced from each other to define air passages extending from an inlet to an outlet of the air channel. Each fin plate has a trailing section extending to the outlet and forming at least one inclined guide tab and an opening defined in the fin plate immediately close to the guide tab for switching at least a portion of the air between adjacent air passages on opposite sides of the fin plate. This increases the length of the path that the air flows through the air channel and thus raises the amount of heat exchanged between the fin plates and the air thereby enhancing efficiency of heat removal.

Abstract: A heat dissipation device includes a casing forming a receptacle for receiving and retaining a fan module and a finned structure that includes spaced fins to define channels through air flows for primary exchange of heat with the heat dissipation device. The heat dissipation device further includes a thermally conductive surface cover board that is mounted to the casing to at least partly cover an air entrance that is defined in the casing to allow air to be drawn into the casing by the fan module. The surface cover board defines air passages through which air is conducted into the casing. Heat is exchanged with the air when the airflow passes through the surface cover board. Thus, the heat dissipation device features twice heat exchange with airflow and thus enhanced heat removal rate by simply adding the surface cover board to the casing and without significant modification of the existing heat dissipation device.

Abstract: A heat dissipation module includes an airflow generation device that generates airflow into an air channel in which a fin module is received and fixed. The fin module includes a plurality of fin plates substantially parallel to and spaced from each other to define air passages extending from an inlet to an outlet of the air channel. Each fin plate has a trailing section extending to the outlet and forming at least one inclined guide tab and an opening defined in the fin plate immediately close to the guide tab for switching at least a portion of the air between adjacent air passages on opposite sides of the fin plate. This increases the length of the path that the air flows through the air channel and thus raises the amount of heat exchanged between the fin plates and the air thereby enhancing efficiency of heat removal.

Abstract: A heat dissipation device includes a casing forming a receptacle for receiving and retaining a fan module and a finned structure that includes spaced fins to define channels through air flows for primary exchange of heat with the heat dissipation device. The heat dissipation device further includes a thermally conductive surface cover board that is mounted to the casing to at least partly cover an air entrance that is defined in the casing to allow air to be drawn into the casing by the fan module. The surface cover board defines air passages through which air is conducted into the casing. Heat is exchanged with the air when the airflow passes through the surface cover board. Thus, the heat dissipation device features twice heat exchange with airflow and thus enhanced heat removal rate by simply adding the surface cover board to the casing and without significant modification of the existing heat dissipation device.

Abstract: A heat dissipation module includes an airflow generation device that generates airflow into an air channel in which a fin module is received and fixed. The fin module includes a plurality of fin plates substantially parallel to and spaced from each other to define air passages extending from an inlet to an outlet of the air channel. Each fin plate has a leading section extending from the inlet and a trailing section extending from the leading section to the outlet. The front end of the leading section is formed with a curved shape guiding head for receiving the airflow. The guiding head generally extends along the same moving direction as the airflow, such that air flows in smoothly via the guiding head to the air passage.

Abstract: A bladed heat sink. The sink includes a connecting board, a plurality of blades, a frame and at least one reinforcing rib. The connecting board is enclosed by the frame. The blades radiate from the connecting board to the frame. Furthermore, the blades are disposed in layers and spaced apart, thereby allowing an airflow to pass between the blades. The blades are also reinforced by the reinforcing rib.

Abstract: A bladed heat sink. The sink includes a connecting board, a plurality of blades, a frame and at least one reinforcing rib. The connecting board is enclosed by the frame. The blades radiate from the connecting board to the frame. Furthermore, the blades are disposed in layers and spaced apart, thereby allowing an airflow to pass between the blades. The blades are also reinforced by the reinforcing rib.

Abstract: A heat dissipation apparatus for dissipating heat of a semiconductor chip module is disclosed. The heat dissipation apparatus includes a base, a plurality of fins, and a heat transfer pipe. The heat transfer pipe has a first opening and a second opening. The first opening is adjacent to the fins which are arranged over the base. The second opening is in a cooling ambient. The heat generated from the semiconductor chip module is conducted away by the base, the fins and then transferred into the cooling ambient through the heat transfer pipe.