Abstract: Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.

Abstract: Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.

Abstract: Device for metering powder, in particular in clean-rooms, which includes a vessel containing powder and a sealing head with a septum for the vessel, wherein the sealing head is connectable powder-tight with the vessel and the septum powder-tight with the sealing head and the device further includes a vessel holder, which serves to hold the sealing head of the vessel, and the vessel with its opening points downwards, so that the powder can flow out of the vessel, wherein a gap is provided between the sealing head and a holding bowl of the vessel holder, in which a gas flow between the holding bowl and the sealing head can be created. The invention also relates to a use of the device and a metered addition method.

Abstract: Device for metering powder, in particular in clean-rooms, which includes a vessel containing powder and a sealing head with a septum for the vessel, wherein the sealing head is connectable powder-tight with the vessel and the septum powder-tight with the sealing head and the device further includes a vessel holder, which serves to hold the sealing head of the vessel, and the vessel with its opening points downwards, so that the powder can flow out of the vessel, wherein a gap is provided between the sealing head and a holding bowl of the vessel holder, in which a gas flow between the holding bowl and the sealing head can be created. The invention also relates to a use of the device and a metered addition method.

Abstract: Electrochemical analysis method and system for monitoring and controlling the quality of electrochemical deposition and/or plating processes. The method uses a fingerprinting analysis method of an output signal to indicate whether the chemistry and/or process is operating in the normally expected range and utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes is analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to provide an output signal fingerprint.

Abstract: The invention relates to an electrochemical analysis method for monitoring and controlling the quality of electrochemical deposition and/or plating processes whereby the electrochemical analysis method uses a fingerprinting analysis method of an output signal to have an indicator of whether the chemistry and/or process is operating in the normally expected range, whereby the method utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes being analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to pro

Abstract: Device for metering powder, in particular in clean-rooms, which includes a vessel containing powder and a sealing head with a septum for the vessel, wherein the sealing head is connectable powder-tight with the vessel and the septum powder-tight with the sealing head and the device further includes a vessel holder, which serves to hold the sealing head of the vessel, and the vessel with its opening points downwards, so that the powder can flow out of the vessel, wherein a gap is provided between the sealing head and a holding bowl of the vessel holder, in which a gas flow between the holding bowl and the sealing head can be created. The invention also relates to a use of the device and a metered addition method.

Abstract: Device for metering powder, in particular in clean-rooms, which includes a vessel containing powder and a sealing head with a septum for the vessel, wherein the sealing head is connectable powder-tight with the vessel and the septum powder-tight with the sealing head and the device further includes a vessel holder, which serves to hold the sealing head of the vessel, and the vessel with its opening points downwards, so that the powder can flow out of the vessel, wherein a gap is provided between the sealing head and a holding bowl of the vessel holder, in which a gas flow between the holding bowl and the sealing head can be created. The invention also relates to a use of the device and a metered addition method.

Abstract: Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece.

Abstract: Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece.

Abstract: Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece.

Abstract: Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece.

Abstract: Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece.

Abstract: Disclosed are an electrodeposition system and method with an anode assembly comprising a capacitor comprising a first conductive plate (i.e., an anode) with a frontside having a surface exposed to a plating solution, a second conductive plate on a backside of the first conductive plate, and a dielectric layer between the two conductive plates. During a non-plating mode, a power source, having positive and negative terminals connected to the first and second conductive plates, respectively, is turned on, thereby polarizing the first conductive plate (i.e., the anode) relative to the second conductive plate to prevent degradation of the anode and/or plating solution. During an active plating mode, another power source, having positive and negative terminals connected to the first conductive plate (i.e., the anode) and a cathode, respectively, is turned on, thereby polarizing the anode relative to the cathode in order to deposit a plated layer on a workpiece.

Abstract: Use of a reference system for electrochemical analysis and deposition methods, in which analysis or deposition methods at least one operating electrode (21), a mating electrode (23) and a reference electrode (22) are used, wherein the reference electrode (22) is a pH electrode (10) that has an impermeable membrane (12), and an input amplifier V1 (16) for the pH electrode (10) having a high input impedance is provided, and supplies the signal from the pH electrode (10) to the input amplifier V1 (16) via a cable, and a further amplifier V2 (17) is provided, which is used to compensate for the disadvantageous effects of the screening and of the cable and of the test setup, or the amplifier V1 (16) is integrated in the pH electrode (10) as an impedance converter, or the amplifier V1 (16) is integrated in the connector of the pH electrode as an impedance converter.

Abstract: The invention relates to an electrochemical analysis method for monitoring and controlling the quality of electrochemical deposition and/or plating processes whereby the electrochemical analysis method uses a fingerprinting analysis method of an output signal to have an indicator of whether the chemistry and/or process is operating in the normally expected range, whereby the method utilizes one or more substrates as working electrode(s) and a) whereby the potential between the one or more working electrodes and one or more reference electrodes being analyzed to provide an output signal fingerprint which is represented as potential difference as a function of time or b) the input power of a process power supply to provide input energy in the form of current and/or potential between the working electrode(s) and a counter-electrode whereby the method utilizes the potential between the one or more working electrode(s) and at least one of: one or more reference electrodes; or one or more counter-electrodes; to pro

Abstract: Method for carrying out a bleed and feed of process solutions in a process tank. The feed solution is pumped out of a first tank into a first receiving space. The first receiving space is subsequently emptied into the process tank of with a pump. The volume of delivered feed solution in the process tank is measured. The bleed solution is pumped from the process tank with a pump into a second receiving space. The volume of delivered bleed solution in the second receiving space is measured. The bleed solution in the second receiving space is subsequently emptied into the second tank. The first receiving space differs from the second receiving space. A correction factor is calculated by comparing the measured and calculated volumes of the bleed and feed solution delivered by the pumps, with which correction factor the nominal delivery volume of the pumps are corrected in the next cycle.

Abstract: The invention relates to a method for carrying out a bleed and feed of process solutions in a process tank, in which the feed solution is pumped out of a first tank T1 into a first receiving space G1 for the feed solution, and the first receiving space G1 is subsequently emptied into the process tank PT by means of a pump P2, whereby the volume of the delivered amount of feed solution in the process tank PT is measured, in which the bleed solution is pumped out of the process tank PT by means of a pump P3 into a second receiving space G2 for the bleed solution, whereby the volume of the delivered amount of bleed solution from the process tank PT in the second receiving space G2 is measured, and the bleed solution in the second receiving space G2 is subsequently emptied into the second tank with the bleed solution, and whereby the first receiving space G1 is different from the second receiving space G2, and whereby a correction factor is always calculated from a comparison of the measured and calculated volume

Abstract: The invention relates to an optical device with at least one radiation source (11), a detector (16), a light guide (12) for the primary radiation and a light guide (17) for further conducting the radiation to be detected to detector (16), wherein the light guide (12) for the primary radiation and the light guide (17) for further conducting the radiation to be detected are each designed in such a way that the radiation emitted at the end (13) of the primary light guide (12) on the sample side, after passage through the sample under investigation, falls directly on the end (18) of the light guide (17) on the sample side for further conducting the radiation to be detected.