Patents by Inventor Juergen Wichelhaus
Juergen Wichelhaus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8871964Abstract: The invention relates to a method for carrying out a chemical reaction for producing a target compound by heating in a reactor a reaction medium containing at least one first reactant, such that a chemical bond inside the first reactant or between the first and a second reactant is formed or modified. The reaction medium is brought into contact with a solid heating medium that can be warmed by electromagnetic induction and that is inside the reactor and is surrounded by the reaction medium. Said heating medium is heated by electromagnetic induction with the aid of an inductor and the target bond is formed from the first reactant or from the first and a second reactant and said target bond is separated from the heating medium.Type: GrantFiled: April 16, 2012Date of Patent: October 28, 2014Assignee: Henkel AG & Co. KGaAInventors: Carsten Friese, Andreas Kirschning, Jürgen Wichelhaus, Sascha Volkan Ceylan
-
Publication number: 20120215023Abstract: A method for performing a chemical reaction to produce a target compound by heating a reaction medium containing a reactant in a reactor, the reaction medium being brought into contact with a solid heating medium that can be heated by electromagnetic induction and that is located inside the reactor and surrounded by the reaction medium and the heating medium being heated by electromagnetic induction with the aid of an inductor, causing the target compound to form, and the target compound being separated from the heating medium, wherein the target compound has a lower molar mass than the reactant and at least one covalent bond of the reactant is cleaved in order to produce said target compound from the reactant.Type: ApplicationFiled: February 21, 2012Publication date: August 23, 2012Inventors: Carsten Friese, Andreas Kirschning, Sascha Volkan Ceylan, Juergen Wichelhaus
-
Publication number: 20120202994Abstract: The invention relates to a method for carrying out a chemical reaction for producing a target compound by heating in a reactor a reaction medium containing at least one first reactant, such that a chemical bond inside the first reactant or between the first and a second reactant is formed or modified. The reaction medium is brought into contact with a solid heating medium that can be warmed by electromagnetic induction and that is inside the reactor and is surrounded by the reaction medium. Said heating medium is heated by electromagnetic induction with the aid of an inductor and the target bond is formed from the first reactant or from the first and a second reactant and said target bond is separated from the heating medium.Type: ApplicationFiled: April 16, 2012Publication date: August 9, 2012Inventors: Carsten Friese, Andreas Kirschning, Jürgen Wichelhaus, Sascha Volkan Ceylau
-
Patent number: 7297756Abstract: Polyamide hot-melt adhesives based on the reaction products of polymeric fatty acids, C14-C18 monocarboxylic acids, C6-C12 dicarboxylic acids and diamines which do not contain any water-extractable, environmentally toxic constituents, which are suitable for sealing cavities in soils, in rock formations, building structures and/or walls, in particular for sealing tunnels, galleries, shafts, channels or caverns, to protect against the penetration of water or the penetration of liquids or gases which contain hazardous substances.Type: GrantFiled: June 21, 2001Date of Patent: November 20, 2007Assignee: Henkel Kommanditgesellschaft Auf AktienInventors: Bettina Becker, Ingolf Scheffler, Juergen Wichelhaus, Liane Meuten
-
Patent number: 7267878Abstract: A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced by a.) fusing the reactive hot-melt-adhesive composition and heating the melt, subject to exclusion of moisture, b.) extruding this melt through one or more dies onto a cooled surface, subject to exclusion of moisture, c.) cooling the granulate, subject to exclusion of moisture, whereby the composition solidifies, d.) removing the cooled hot-melt-adhesive granulate, e.) filling the granulate into moisture-tight packages, subject to exclusion of moisture. These reactive hot-melt adhesives are pourable and free-flowing and therefore can be used with all conventional application machines for hot-melt adhesives.Type: GrantFiled: November 7, 2003Date of Patent: September 11, 2007Assignee: Henkel Kommanditgesellschaft auf Aktien (Henkel KGAA)Inventors: Hartmut Primke, Gerald Petry, Ingolf Scheffler, Juergen Wichelhaus, Michael Krebs, Michael Rudolph, Andrew Nixon, Hans-Peter Kohlstadt
-
Publication number: 20040143034Abstract: A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced byType: ApplicationFiled: November 7, 2003Publication date: July 22, 2004Inventors: Hartmut Primke, Gerald Petry, Ingolf Scheffler, Juergen Wichelhaus, Michael Krebs, Michael Rudolph, Andrew Nixon, Hans-Peter Kohlstadt
-
Publication number: 20040028482Abstract: Polyamide hot-melt adhesives based on the reaction products of polymeric fatty acids, C14-C18 monocarboxylic acids, C6-C12 dicarboxylic acids and diamines which do not contain any water-extractable, environmentally toxic constituents, which are suitable for sealing cavities in soils, in rock formations, building structures and/or walls, in particular for sealing tunnels, galleries, shafts, channels or caverns, to protect against the penetration of water or the penetration of liquids or gases which contain hazardous substances.Type: ApplicationFiled: September 17, 2003Publication date: February 12, 2004Inventors: Bettina Becker, Ingolf Scheffler, Juergen Wichelhaus, Liane Meuten
-
Patent number: 6258885Abstract: A filling compound for electrical and optical equipment in the form of cables, connectors, plugs, etc. and to assemblies thus produced, is provided. Electrical and optical equipment in the form of cables, connectors, plugs, etc. have to be protected against harmful influences penetrating from outside, particularly water, and also against mechanical damage during laying or as a result of exposure to heat. The filling compound is based on a stellate substance, i.e. a substance having a branched molecular structure in which, ideally, 3 or more branches, more particularly polymeric chains, radiate from a single branching point. The filling compound is flexible at very low temperatures but, on the other hand, does not run out, even at extremely high temperatures.Type: GrantFiled: January 13, 1999Date of Patent: July 10, 2001Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Reimar Heucher, Juergen Wichelhaus, Johannes Andres
-
Patent number: 5902849Abstract: A filling compound for electrical and optical equipment in the form of cables, connectors, plugs etc. and to assemblies thus produced, is provided. Electrical and optical equipment in the form of cables, connectors, plugs etc. have to be protected against harmful influences penetrating from outside, particularly water, and also against mechanical damage during laying or as a result of exposure to heat. The filling compound is based on a stellate substance, i.e. a substance having a branched molecular structure in which, ideally, 3 or more branches, more particularly polymeric chains, radiate from a single branching point. The filling compound is flexible at very low temperatures but, on the other hand, does not run out, even at extremely high temperatures.Type: GrantFiled: November 12, 1996Date of Patent: May 11, 1999Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Reimar Heucher, Juergen Wichelhaus, Johannes Andres
-
Patent number: 5548027Abstract: A hotmelt adhesive based on a number of components is provided. One of the components is at least one polyamide based on dimerized fatty acid, said polyamide being present in an amount by weight of the composition of at least 50%. Another component is from at least one ethylene copolymer selected from the group consisting of ethylene/vinyl acetate, ethylene/acrylate, said acrylate being derived from an alcohol containing 1 to 18 carbon atoms, and ethylene/methacrylate, said methacrylate being derived from an alcohol containing 1 to 18 carbon atoms, said ethylene copolymer being present in an amount by weight of the composition of 5 to 20%. Another component is at least one copolymer of styrene with one or more members selected from the group consisting of ethylene, isoprene and butylene, said copolymer of styrene being present in an amount by weight of the composition of 2 to 10%.Type: GrantFiled: October 13, 1994Date of Patent: August 20, 1996Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Reimar Heucher, Juergen Wichelhaus, Kurt Schueller, Siegfried Kopannia, Angela Rossini
-
Patent number: 5519109Abstract: Moisture-curing polyamides containing reactive alkoxysilane groups and a process for their preparation are provided. The reactive alkoxysilane groups contain organic groups which are not reactive during the production process, the intended application or the curing process. These moisture-curing polyamides have low melt viscosities and are useful as sealing compounds, hotmelt adhesives and encapsulating materials.Type: GrantFiled: January 17, 1995Date of Patent: May 21, 1996Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Hans-Georg Kinzelmann, Reimar Heucher, Juergen Wichelhaus
-
Patent number: 5510405Abstract: A plug-type connector for electrical coaxial cables includes a hot-melt-type adhesive for filling in the interior space between an outer bushing and centrally located contact bushing, with the contact bushing being configured for receiving an inner conductor of a coaxial cable. The hot-melt-type adhesive seals, fills, and insulates the interior portions of the plug-type connector surrounding the centrally located contact bushing and inner conductor of the associated coaxial cable. The hot-melt-type adhesive consists a polyamide based on dimerized fatty acids, aliphatic amines, and modifiers, and a copolyethylene and additives.Type: GrantFiled: January 27, 1994Date of Patent: April 23, 1996Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Reimar Heucher, Juergen Wichelhaus, Kurt Schueller, Bettina Becker
-
Patent number: 5455309Abstract: Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cycloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.Type: GrantFiled: August 3, 1990Date of Patent: October 3, 1995Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Italo Albini, Werner Gruber, Norbert Wiemers, Juergen Wichelhaus, Roberto Leoni, Angela Rossini
-
Patent number: 5412022Abstract: A lyo gel is provided in which the gelling agent is an organic, fully synthetic polymer, which is crosslinked via its carboxylic acid groups and via metal compounds, and the swelling agent is a low-volatility, inert organic liquid having a volatility, as defined by its evaporation loss, of less than 0.5% by weight after 2 hours at 105.degree. C. in accordance with ASTM D 972. The lyo gel is useful for sealing devices involving the use of electrical current because the initially two-component reaction solution is sufficiently liquid at room temperature to fill even small spaces, such as gaps and joints between bodies.Type: GrantFiled: June 14, 1993Date of Patent: May 2, 1995Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Johannes Andres, Juergen Wichelhaus, Reimar Heucher
-
Patent number: 5004794Abstract: New isocyanate prepolymers obtainable from polyethers and/or polyesters containing 2 OH groups and diisocyanates and triols in a two-step process and their use as principal component in sealing compounds, adhesives and coating compositions.Type: GrantFiled: December 4, 1987Date of Patent: April 2, 1991Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Winfried Emmerling, Juergen Wichelhaus, Tore Podola
-
Patent number: 4992500Abstract: Aqueous dispersions of thermoplastic polyamides based on dimeric fatty acids having melting points of at least 120.degree. C. or of mixtures of these thermoplastic polyamides, in which at least 20% of the polyamide has a melting point of at least 120.degree. C., and which contain salts of rosin derivatives having acid values of more than 120 as emulsifiers, show excellent properties as adhesives.Type: GrantFiled: February 1, 1989Date of Patent: February 12, 1991Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Wolfgang Klauck, Gerhard Gierenz, Juergen Wichelhaus
-
Patent number: 4957979Abstract: Methods of producing thermoplastic poly(amide-urethane) block copolymers having excellent flexibility at low temperatures are provided. The methods comprise reacting substantially linear polyamides, the polyamides being based on dimerized fatty acids and terminated by carboxyl and/or amino groups and aliphatic or cyloaliphatic polyethers and/or reaction products thereof with 2,3-epoxypropanol. The reaction products contain substantially no free isocyanate groups or epoxide groups. The invention also relates to the use of these products as adhesives and corrosion inhibitors for metallic and/or wooden materials.Type: GrantFiled: December 5, 1988Date of Patent: September 18, 1990Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Italo Albini, Werner Gruber, Norbert Wiemers, Juergen Wichelhaus, Roberto Leoni, Angela Rossini
-
Patent number: 4914162Abstract: Thermoplastic polyamide mixtures of polyamides based on dimerized fatty acids in which at least one polyamide contains as an incorporated unit (a) a C.sub.2 -C.sub.10 aliphatic diamine capable of diamide formation, which is N-substituted with C.sub.10 -C.sub.25 -alkyl, and (b) a C.sub.2 -C.sub.40 -diamine capable of diamide formation comprising a diprimary amine, a heterocyclic amine, or a diomine containing one or two secondary amino groups and which is N-C.sub.1 -C.sub.8 -alkyl-substituted on at least one side.Type: GrantFiled: October 31, 1988Date of Patent: April 3, 1990Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Roberto Leoni, Werner Gruber, Juergen Wichelhaus
-
Patent number: 4824888Abstract: Diurethanes corresponding to general formula (I) or (II) belowR.sup.1 --NH--CO--O--R.sup.2 --O--CO--NH--R.sup.1 (I)R.sup.3 --O--CO--NH--R.sup.4 --NH--CO--OR.sup.3 (II)in which R.sup.1 is a C.sub.3 -C.sub.22 alkyl or aralkyl radical or a phenyl radical, R.sup.2 is a residue of a difunctional polypropylene glycol having a number average molecular weight of from 1000 to 4000, R.sup.3 is the residue of a monofunctional polypropylene glycol monoalkyl ether having a number average molecular weight of from 500 to 2000, and R.sup.4 is C.sub.4 -C.sub.36 alkylene group, a diaryl methane group or a tolylidene group, as stabilizing agents for sealing compositions, for isocyanate-terminated polyurethane prepolymers, and for polyvinyl chlorides and copolymers of vinyl chloride.Type: GrantFiled: May 3, 1988Date of Patent: April 25, 1989Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Winfried Emmerling, Tore Podola, Juergen Wichelhaus
-
Patent number: 4810772Abstract: Thermoplastic polyamide mixtures of polyamides based on dimerized fatty acids in which at least one polyamide contains as an incorporated unit (a) a C.sub.2 -C.sub.10 aliphatic diamine capable of diamide formation, which is N-substituted with C.sub.10 -C.sub.25 -alkyl, and (b) a C.sub.2 -C.sub.40 -diamine capable of diamide formation comprising a diprimary amine, a heterocyclic amine, or a diomine containing one or two secondary amino groups and which is N-C.sub.1 -C.sub.8 -alkyl-substituted on at least one side.Type: GrantFiled: April 1, 1987Date of Patent: March 7, 1989Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Roberto Leoni, Werner Gruber, Juergen Wichelhaus