Patents by Inventor JuGang Zhang

JuGang Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8446696
    Abstract: A suspension for a head gimbal assembly comprises a flexure having a flexure having a tail with a plurality of electrical traces and a plurality of bonding terminals adapted for connecting with a flexible printed circuit formed thereon. Each of the bonding terminals comprises a connecting pad and a hole formed at one end of the connecting pad for electrically and mechanically connecting the connecting pad to the flexible printed circuit by bonding material. And the connecting pad has a bonding portion adjacent to the hole and an exposed portion for testing. The invention also discloses a head gimbal assembly and a disk drive unit with the same.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: May 21, 2013
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Xianwen Feng, Jugang Zhang, Tan Tian
  • Publication number: 20110090599
    Abstract: A suspension for a head gimbal assembly comprises a flexure having a flexure having a tail with a plurality of electrical traces and a plurality of bonding terminals adapted for connecting with a flexible printed circuit formed thereon. Each of the bonding terminals comprises a connecting pad and a hole formed at one end of the connecting pad for electrically and mechanically connecting the connecting pad to the flexible printed circuit by bonding material. And the connecting pad has a bonding portion adjacent to the hole and an exposed portion for testing. The invention also discloses a head gimbal assembly and a disk drive unit with the same.
    Type: Application
    Filed: October 19, 2009
    Publication date: April 21, 2011
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Xianwen Feng, Jugang Zhang, Tan Tian
  • Patent number: 7777991
    Abstract: A head gimbal assembly (HGA) has an improved interconnection between a head slider and a suspension of the HGA. The interconnection is achieved by using a reverse surface of an air bearing surface of the head slider as bonding surface to provide more space for arranging more slider electrical bonding pads thereon. The head slider is mechanically and electrically connected to the suspension at the bonding surface to have good performance on shocking conditions. The suspension further has an attitude control layer located between the head slider and the suspension. The attitude control layer serves as a datum plate for the head slider lying thereon and supporting the head slider so as to ensure the head slider a good attitude and reduce variation of slider flying height. The present invention also discloses a magnetic disk drive with the improved HGA and a fabricating method for the HGA.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: August 17, 2010
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: XianWen Feng, YiHua Pei, JuGang Zhang, ShuMing Zhang, Takeshi Nakada, ShanLin Hao
  • Publication number: 20080170326
    Abstract: A head gimbal assembly (HGA) has an improved interconnection between a head slider and a suspension of the HGA. The interconnection is achieved by using a reverse surface of an air bearing surface of the head slider as bonding surface to provide more space for arranging more slider electrical bonding pads thereon. The head slider is mechanically and electrically connected to the suspension at the bonding surface to have good performance on shocking conditions. The suspension further has an attitude control layer located between the head slider and the suspension. The attitude control layer serves as a datum plate for the head slider lying thereon and supporting the head slider so as to ensure the head slider a good attitude and reduce variation of slider flying height. The present invention also discloses a magnetic disk drive with the improved HGA and a fabricating method for the HGA.
    Type: Application
    Filed: January 12, 2007
    Publication date: July 17, 2008
    Inventors: XianWen Feng, YiHua Pei, JuGang Zhang, ShuMing Zhang, Takeshi Nakada, ShanLin Hao