Patents by Inventor Ju Hyeon Kim
Ju Hyeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240194481Abstract: Disclosed is a method of forming a thin film using a chemical purge material, the method comprising supplying a metal precursor to the inside of a chamber oh which a substrate is placed; purging the interior of the chamber; supplying a reactant to the inside of the chamber so that the reactant reacts with the metal precursor to form the thin film; and supplying a chemical purge material to the inside of the chamber so that a portion of the reactant is removed.Type: ApplicationFiled: November 24, 2023Publication date: June 13, 2024Applicant: EGTM Co., Ltd.Inventors: Kyu Ho CHO, Jae Min KIM, Ha Na KIM, Ji Yeon HAN, Duck Hyeon SEO, Ju Hwan JEONG, Hyun Ju JUNG
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Publication number: 20240194372Abstract: The present invention relates to an insulating gas used for electrical insulation or arc extinguishing of an electrical device, and an electrical device for insulating electricity using the same. The insulating gas of the present invention, which may replace SF6 gas, consists of a mixed gas of trifluoromethyl trifluorovinyl ether (CF3OCFCF2) and a carrier gas. The insulating gas of the present invention has the characteristics of a low boiling point, high dielectric strength, low toxicity, and a low global warming potential (GWP=1 or less), and thus may replace SF6, and the low global warming potential with no loss of high insulating capacity and arc extinguishing capability may reduce greenhouse gases.Type: ApplicationFiled: October 25, 2021Publication date: June 13, 2024Applicants: KOREA ELECTRO TECHNOLOGY RESEARCH INSTITUTE, KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGYInventors: Ki Dong SONG, Yeon Ho OH, Hyun Jae JANG, In Joon PARK, Won Wook SO, Shin Hong YOOK, Sang Goo LEE, Hong suk KANG, Ju Hyeon KIM, Ji Hoon BAIK, Eun Ho SOHN, Myoung Sook LEE, Bong Jun CHANG
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Publication number: 20240186644Abstract: An activation method for a lithium secondary battery includes: a primary charging process charging a lithium secondary battery; a first degassing process discharging an internal gas containing oxygen to an outside of the lithium secondary battery or moving the internal gas containing oxygen to a gas pocket part after the primary charging process; an aging process aging the lithium secondary battery after the first degassing process; and a second degassing process removing gas from the aged lithium secondary battery.Type: ApplicationFiled: November 22, 2022Publication date: June 6, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Sung Hoon YU, Eui Kyung LEE, Sang Jih KIM, Suk Hyun HONG, Ju Hyeon CHO
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Publication number: 20240163462Abstract: Provided is an apparatus for image encoding, the apparatus including: a transmitter memory configured to store a program for encoding a stereoscopic 3D image; and an encoding processor configured to execute the program stored in the transmitter memory, wherein the encoding processor is configured to: generate a first stream and a second stream from a left image and a down-converted right image, decode the first stream and the second stream to generate a decoded left image and a first decoded right image; generate a third stream from the decoded left image, the first decoded right image, and an original right image, and decode the third stream to generate a second decoded right image; and generate a fourth stream from the second decoded right image and the original right image.Type: ApplicationFiled: October 26, 2023Publication date: May 16, 2024Applicants: Electronics and Telecommunications Research Institute, KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATIONInventors: Sung Hoon KIM, Seong Won JUNG, Dong Wook KANG, Kyeong Hoon JUNG, Seung Jun LEE, Ju Hyeon LEE
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Publication number: 20240124438Abstract: Provided are a phenanthroline-based compound, a method of preparing the same, and a perovskite solar cell including the same. The phenanthroline-based compound may be formed as a uniform layer even by a solution process due to its low average surface roughness (root mean square, RMS) and excellent processability. When a layer having the phenanthroline-based compound is provided as a polymer functional layer of the perovskite solar cell, the ionic defects on the surface between the perovskite and a metal oxide, may be passivated and charge transfer may be facilitated so that the energy efficiency and photostability of the solar cell are improved.Type: ApplicationFiled: August 29, 2023Publication date: April 18, 2024Inventors: Kwang Hee LEE, Hee Joo KIM, Yong Ryun KIM, Ju Hyeon KIM
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Publication number: 20240083018Abstract: An embodiment device includes an input module including a motor configured to generate a rotational force, an output module configured to receive power from the input module to be rotatable, and a connection module having a first side coupled to the input module and a second side, opposite the first side, coupled to the output module, wherein the connection module is configured to transmit the power from the input module to the output module.Type: ApplicationFiled: February 9, 2023Publication date: March 14, 2024Inventors: Hyo-Joong Kim, Sang In Park, Ki Hyeon Bae, Ju Young Yoon, Beom Su Kim, Min Woong Jeung, Seong Taek Hwang, Ho Jun Kim, Hyun Seop Lim, Kyu Jung Kim
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Patent number: 11919999Abstract: Provided are a method for preparing a polyetherketoneketone and a polyetherketoneketone prepared thereby, wherein, at the time of a polymerization reaction, nitrogen gas is blown into a liquid reaction medium while stirring, thereby quickly removing hydrochloric acid, which is a by-product generated during the reaction, and preventing aggregation of resin particles, thus suppressing the generation of scales.Type: GrantFiled: November 16, 2018Date of Patent: March 5, 2024Assignee: HANWHA CHEMICAL CORPORATIONInventors: Kwang Seok Jeong, Min Sung Kim, Jae Heon Kim, Ju Young Park, Cho Hee Ahn, Byeong Hyeon Lee, Sang Hyun Cho
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Patent number: 11834415Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.Type: GrantFiled: April 17, 2019Date of Patent: December 5, 2023Assignee: LG CHEM, LTD.Inventors: Ju Hyeon Kim, Junghak Kim, Seunghee Nam, Kwang Joo Lee
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Publication number: 20230174834Abstract: The present invention relates to an adhesive composition for a semiconductor and an adhesive film for a semiconductor including a cured product thereof, and in particular, to an adhesive composition for a semiconductor capable of removing voids occurring between an adherend and an adhesive and reducing bleed-out, and an adhesive film for a semiconductor including a cured product thereof.Type: ApplicationFiled: October 20, 2020Publication date: June 8, 2023Applicant: LG CHEM, LTD.Inventors: Eun Bum KIM, Kwang Joo LEE, Jung Hak KIM, Ju Hyeon KIM, Yoon Sun JANG
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Publication number: 20230051048Abstract: Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.Type: ApplicationFiled: February 4, 2021Publication date: February 16, 2023Applicant: LG CHEM, LTD.Inventors: Eun Bum KIM, Ju Hyeon KIM, Kwang Joo LEE, Jung Hak KIM, Yoon Sun JANG
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Publication number: 20210292616Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.Type: ApplicationFiled: June 5, 2020Publication date: September 23, 2021Applicant: LG CHEM, LTD.Inventors: Junghak KIM, You Jin KYUNG, Kwang Joo LEE, Minsu JEONG, Ju Hyeon KIM, Youngsam KIM
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Publication number: 20210292618Abstract: The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.Type: ApplicationFiled: May 8, 2020Publication date: September 23, 2021Applicant: LG CHEM, LTD.Inventors: Youngsam KIM, You Jin KYUNG, Kwang Joo LEE, Minsu JEONG, Junghak KIM, Ju Hyeon KIM
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Publication number: 20210277246Abstract: The present disclosure relates to a compound represented by Chemical Formula 1, a probe for detecting antibiotic-resistant bacteria, which includes the compound, a composition containing the compound, a kit including the compound and a method for detecting antibiotic-resistant bacteria. A compound probe having a carbapenem structure and including a linker and a fluorophore can detect beta-lactamase or carbapenemase at high sensitivity and, therefore, can be applied to various biochemical researches. In addition, the compound probe can clinically detect carbapenemase-producing antibiotic-resistant bacteria and allows molecular diagnosis of antibiotic-resistant bacterial infectious diseases and analysis of antibiotic-resistant bacteria from a target sample at high sensitivity. Therefore, it can be effectively used for medicinal uses such as in-vitro diagnosis.Type: ApplicationFiled: July 30, 2019Publication date: September 9, 2021Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUSInventors: Sun Joon MIN, Yeon Joon PARK, Ju Hyeon KIM
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Publication number: 20210115021Abstract: The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.Type: ApplicationFiled: October 22, 2019Publication date: April 22, 2021Applicant: LG CHEM, LTD.Inventors: Youngsam KIM, Junghak KIM, Ju Hyeon KIM, Kwang Joo LEE
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Publication number: 20200308121Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.Type: ApplicationFiled: April 17, 2019Publication date: October 1, 2020Applicant: LG CHEM, LTD.Inventors: Ju Hyeon KIM, Junghak KIM, Seunghee NAM, Kwang Joo LEE
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Patent number: 10332855Abstract: A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.Type: GrantFiled: March 7, 2017Date of Patent: June 25, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Doo Hwan Lee, Ju Hyeon Kim, Dae Kyu Ahn, Sung Won Jeong
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Publication number: 20190164862Abstract: A semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads of the semiconductor chip. A wall of the through-hole has an uneven portion.Type: ApplicationFiled: May 24, 2018Publication date: May 30, 2019Inventors: Ju Hyeon KIM, Doo Hwan LEE
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Patent number: 10134695Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip.Type: GrantFiled: March 15, 2017Date of Patent: November 20, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Doo Hwan Lee, Ju Hyeon Kim, Hyoung Joon Kim, Joon Sung Kim
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Publication number: 20180082962Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip.Type: ApplicationFiled: March 15, 2017Publication date: March 22, 2018Inventors: Doo Hwan LEE, Ju Hyeon KIM, Hyoung Joon KIM, Joon Sung KIM
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Publication number: 20170365572Abstract: A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the semiconductor chip. A second connection member is on the first connection member and the semiconductor chip. The first connection member and the second connection member each include a redistribution layer electrically connected to a connection pad of the semiconductor chip. The interface between the second connection member and the encapsulant is located on a different level from the level of the interface between the second connection member and a redistribution layer of the first connection member or the level of the interface between the second connection member and a connection pad of the semiconductor chip.Type: ApplicationFiled: March 7, 2017Publication date: December 21, 2017Inventors: Doo Hwan LEE, Ju Hyeon KIM, Dae Kyu AHN, Sung Won JEONG