Abstract: Systems, methods, apparatuses for fan type identification are disclosed. A predetermined pulse width modulation duty cycle is used to obtain a sequence of fan speeds from a fan over a time period. A fan type of the fan is determined based on the sequence of fan speeds.

Abstract: A heat dissipation control method includes determining a total power consumption of a heat generating component and a heat dissipating component, determining a heat dissipation parameter based on the total power consumption of the heat generating component and the heat dissipating component, and controlling an operating state of the heat dissipating component based on the heat dissipation parameter.

Abstract: Systems, methods, apparatuses for fan type identification are disclosed. A predetermined pulse width modulation duty cycle is used to obtain a sequence of fan speeds from a fan over a time period. A fan type of the fan is determined based on the sequence of fan speeds.

Abstract: A water-cooled server and an electronic device are provided. The water-cooled server comprises a cooling main tubing, wherein the cooling main tubing guides cooling water; a drainage branch tubing operatively coupled to cooling main tubing; a piston having a first end disposed in the drainage branch tubing and a second end disposed in the cooling main tubing, wherein the first end drives the second end to a first position under pressure of the cooling water to prevent the second end from plugging the cooling main tubing; and an elastic member operatively coupled to the piston, wherein the elastic member drives the second end of the piston to move to a second position to plug the cooling main tubing. An elastic force applied to the piston by the elastic member is smaller than maximum pressure applied to the piston by the cooling water.

Abstract: A heat dissipation control method includes determining a total power consumption of a heat generating component and a heat dissipating component, determining a heat dissipation parameter based on the total power consumption of the heat generating component and the heat dissipating component, and controlling an operating state of the heat dissipating component based on the heat dissipation parameter.

Abstract: A water-cooled server and an electronic device are provided. The water-cooled server comprises a cooling main tubing, wherein the cooling main tubing guides cooling water; a drainage branch tubing operatively coupled to cooling main tubing; a piston having a first end disposed in the drainage branch tubing and a second end disposed in the cooling main tubing, wherein the first end drives the second end to a first position under pressure of the cooling water to prevent the second end from plugging the cooling main tubing; and an elastic member operatively coupled to the piston, wherein the elastic member drives the second end of the piston to move to a second position to plug the cooling main tubing. An elastic force applied to the piston by the elastic member is smaller than maximum pressure applied to the piston by the cooling water.

Abstract: A cooling system includes a first heat exchanging component configured to connect to a heat source and obtain heat of the heat source by heat transfer, to dissipate heat of the heat source; and a first pipe configured to connect to the first heat exchanging component and a second heat exchanging component and form a loop between the first and second heat exchanging components, and to transfer the heat obtained by the first heat exchanging component to the second heat exchanging component via the loop. A first position relationship is provided between the first heat exchanging component and the second heat exchanging component, to allow a cooling liquid in the first pipe to automatically flow into the second heat exchanging component after the cooling liquid exchanges heat with the first heat exchanging component, to transfer the heat generated by the heat source to the second heat exchanging component.

Abstract: One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.

Abstract: One embodiment provides rotating shaft, including: a spindle comprising an internal first channel; a wheel casing operatively coupled to the spindle, wherein the wheel casing comprises an internal second channel; and a bearing housing the spindle, comprising a third channel located between the bearing and the spindle; wherein the first channel, the second channel, and the third channel are located to form an enclosed annular channel configured to hold a substance. Other aspects are described and claimed.

Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.

Abstract: A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.

Abstract: A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.

Abstract: Disclosed is a heat sink module for an electronic device, comprising a substrate having at least a fixed hole, at least a heat sink fin set disposed on the substrate and having a plurality of heat sink fins and at least a resilient plate disposed on the substrate and having at least a mount hole mounting the substrate on an electronic device component in the electronic device in coordination with the fixed hole so that the substrate can be closely bonded to a surface of the electronic component. Further, since the heat sink fin set is formed on the substrate by punching method, an advantage of low cost of the heat sink module is provided.

Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.

Abstract: Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.

Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.

Abstract: An injector with a coating head, for uniformly coating a heat sink paste onto a surface to be coated is provided, which includes a body, a piston, and a coating head, wherein the piston is pressed to force the heat sink paste out of the body through the coating head, and the heat sink paste is molded by the coating head into a shape suitable for uniformly coating the surface to be coated, and is also quantified. Moreover, a scraping surface is provided at the opening of the coating head, for scraping off the redundant heat sink paste from the steel plate and for smoothing the surface of the heat sink paste, in the case that a steel plate is used to assist the quantifying operation of the heat sink paste.

Abstract: A heat conducting medium protection device is provided. At least one cutout is formed in a sheet, and the sheet is bent to closely engage the cutouts so as to transform the sheet into a three-dimensional shape and form an accommodating space. When the heat conducting medium protection device is covered on a heat sink coated with a heat conducting medium, the accommodating space accommodates the heat conducting medium for holding the heat conducting medium, thereby making it easy to transmit the heat sink coated with a heat conducting medium.

Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.

Abstract: Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.