Patents by Inventor Jui-Ho Liu

Jui-Ho Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8328601
    Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: December 11, 2012
    Assignees: Golden Sun News Techniques Co., Ltd., CPUmate Inc
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Jui-Ho Liu, Chih-Hung Cheng, Ken Hsu
  • Publication number: 20120276822
    Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
    Type: Application
    Filed: March 1, 2012
    Publication date: November 1, 2012
    Inventors: Kuo-Len LIN, Chen-Hsiang Lin, Jui-Ho Liu, Chih-Hung Cheng, Ken Hsu
  • Patent number: 8235768
    Abstract: A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: August 7, 2012
    Assignees: Golden Sun News Techniques Co., Ltd., Cpumate Inc
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Jui-Ho Liu, Chih-Hung Cheng, Ken Hsu
  • Publication number: 20120160458
    Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
    Type: Application
    Filed: March 1, 2012
    Publication date: June 28, 2012
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Jui-Ho Liu, Chih-Hung Cheng, Ken Hsu
  • Publication number: 20100314078
    Abstract: A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.
    Type: Application
    Filed: June 10, 2009
    Publication date: December 16, 2010
    Inventors: Kuo-Len LIN, Chen-Hsiang LIN, Jui-Ho LIU, Chih-Hung CHENG, Ken HSU
  • Publication number: 20100294462
    Abstract: A heat sink and heat-dissipating fins have wave-shaped folds. The heat sink includes a plurality of heat-dissipating fins that are radially connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing a heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape. Via the wave-shaped folds, the user can grip the heat-dissipating fins easily. Further, the rigidness and strength of the fold can be increased.
    Type: Application
    Filed: May 19, 2009
    Publication date: November 25, 2010
    Inventors: Kuo-Len Lin, Chen-Hsiang Lin, Jui-Ho Liu, Chih-Hung Cheng, Ken Hsu