Abstract: A trace structure includes a substrate, at least one metal trace, and a cover. The metal trace is disposed on the substrate, and has sidewalls and a top surface. The cover is disposed on the sidewalls and the top surface of the metal trace, and the cover includes metal nanowires. The cover and the metal trace have different etch resistances.

Abstract: An electronic device includes a substrate, a Wheatstone bridge circuit, a power module, and a controller. The Wheatstone bridge circuit includes a first pressure sensing electrode disposed on the substrate. A resistance of the first pressure sensing electrode varies with pressure applied to the first pressure sensing electrode. The first pressure sensing electrode is coil-shaped. The power module is electrically connected to the Wheatstone bridge circuit. The controller is configured to control the power module to provide direct current (DC) to the Wheatstone bridge circuit within a first period of time, and to control the power module to provide alternating current (AC) to the Wheatstone bridge circuit within a second period of time.

Abstract: An electronic device includes a substrate, a Wheatstone bridge circuit, a power module, and a controller. The Wheatstone bridge circuit includes a first pressure sensing electrode disposed on the substrate. A resistance of the first pressure sensing electrode varies with pressure applied to the first pressure sensing electrode. The first pressure sensing electrode is coil-shaped. The power module is electrically connected to the Wheatstone bridge circuit. The controller is configured to control the power module to provide direct current (DC) to the Wheatstone bridge circuit within a first period of time, and to control the power module to provide alternating current (AC) to the Wheatstone bridge circuit within a second period of time.

Abstract: A trace structure includes a substrate, at least one metal trace, and a cover. The metal trace is disposed on the substrate, and has sidewalls and a top surface. The cover is disposed on the sidewalls and the top surface of the metal trace, and the cover includes metal nanowires. The cover and the metal trace have different etch resistances.

Abstract: A touch panel comprises a sensing area, a periphery area, a plurality of wires and a plurality of bonding pads. The periphery area is disposed around the sensing area. The periphery area comprises a bonding area. The wires are disposed in the periphery area. The bonding pads are disposed in the bonding area and electrical connected to the wires correspondingly. Each of the bonding pads comprises at least a bending portion.

Abstract: A touch panel including a flexible substrate, first and second electrode patterns and a trace structure is mounted inside a casing unit with a main casing and a side frame connected to a periphery of the main casing and provided with a key icon. The substrate is disposed in the casing unit and includes first and second areas respectively corresponding to the main casing and side frame. The first electrode pattern is formed on the substrate at the first area. The second electrode pattern is formed on the substrate at the second area corresponding to the key icon. The trace structure is formed on the substrate with contacts and traces connected among the first electrode pattern, the second electrode pattern and the contacts.

Abstract: A circuit device is provided. The circuit device comprises a transparent substrate, a first transparent blocking layer, a first patterned conductive layer, and a second conductive layer. The transparent substrate has a first surface. The first transparent blocking layer is disposed on the first surface. The first patterned conductive layer is disposed on the first transparent blocking layer, and the second conductive layer is disposed on a side of the transparent substrate opposite to the first surface.

Abstract: A touch panel including a flexible substrate, first and second electrode patterns and a trace structure is mounted inside a casing unit with a main casing and a side frame connected to a periphery of the main casing and provided with a key icon. The substrate is disposed in the casing unit and includes first and second areas respectively corresponding to the main casing and side frame. The first electrode pattern is formed on the substrate at the first area. The second electrode pattern is formed on the substrate at the second area corresponding to the key icon. The trace structure is formed on the substrate with contacts and traces connected among the first electrode pattern, the second electrode pattern and the contacts.

Abstract: A circuit device is provided. The circuit device comprises a transparent substrate, a first transparent blocking layer, a first patterned conductive layer, and a second conductive layer. The transparent substrate has a first surface. The first transparent blocking layer is disposed on the first surface. The first patterned conductive layer is disposed on the first transparent blocking layer, and the second conductive layer is disposed on a side of the transparent substrate opposite to the first surface.

Abstract: A touch panel comprises a sensing area, a periphery area, a plurality of wires and a plurality of bonding pads. The periphery area is disposed around the sensing area. The periphery area comprises a bonding area. The wires are disposed in the periphery area. The bonding pads are disposed in the bonding area and electrical connected to the wires correspondingly. Each of the bonding pads comprises at least a bending portion.