Patents by Inventor Jui-Hsuan Cheng

Jui-Hsuan Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead structure of circuit with increased gaps between adjacent leads
    Patent number: 11217508
    Abstract: The present invention discloses a lead structure of the circuit, which comprises a first lead and a second lead. The first lead includes a first bump connecting part and a first lead segment. The first lead segment is connected to the first bump connecting part. The width of the first lead segment is smaller than the width of the first bump connecting part. The second lead is adjacent to the first lead and there is a lead gap therebetween. The second lead also includes a second bump connecting part and a first lead segment. The first lead segment of the second lead is connected to the second bump connecting part. The second bump connecting part and the first bump connecting part are arranged staggeredly. The second bump connecting part is adjacent to the first lead segment of the first lead.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: January 4, 2022
    Assignee: Sitronix Technology Corp.
    Inventors: Kuo-Wei Tseng, Po-Chi Chen, Jui-Hsuan Cheng
  • LEAD STRUCTURE OF CIRCUIT
    Publication number: 20190115285
    Abstract: The present invention discloses a lead structure of the circuit, which comprises a first lead and a second lead. The first lead includes a first bump connecting part and a first lead segment. The first lead segment is connected to the first bump connecting part. The width of the first lead segment is smaller than the width of the first bump connecting part. The second lead is adjacent to the first lead and there is a lead gap therebetween. The second lead also includes a second bump connecting part and a first lead segment. The first lead segment of the second lead is connected to the second bump connecting part. The second bump connecting part and the first bump connecting part are arranged staggeredly. The second bump connecting part is adjacent to the first lead segment of the first lead.
    Type: Application
    Filed: October 16, 2018
    Publication date: April 18, 2019
    Inventors: Kuo-Wei Tseng, Po-Chi Chen, Jui-Hsuan Cheng