Abstract: The present invention relates to a method for splitting circles, and the method is mainly applied to a wafer of semiconductors. A plurality of splitting blades are disposed above the wafer, and conditions and steps are set for switching the plurality of splitting blades based on a safe distance value set at an outer edge of a wafer or a safe distance value set at an inner edge of a metal ring. Accordingly, the plurality of splitting blades are prevented from cutting an outer frame during splitting and failing to complete actions of splitting wafers. The method has an advantage of efficiency of enhancing a production capacity yield rate.